Ranjan Joseph Mathew

US Patent:

6356334, Mar 12, 2002

Filed:

Aug 6, 1998

Appl. No.:

09/130631

Inventors:

Ranjan J. Mathew - San Jose CA
Seshadri Vikram - Fremont CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 11333

US Classification:

349153, 349 58, 349149

Abstract:

Apparatus are disclosed for Liquid Crystal Display (LCD) assemblies having a display device that is attached to a support substrate. The display device includes a die having a pixel array, and a transparent plate positioned over the die. An adhesive seal couples the die to the transparent plate. The seal together with the transparent plate and the die cooperate to define a sealed volume therebetween encompassing the pixel array. A liquid crystal material is disposed within the sealed volume. A support substrate is coupled to the transparent plate for support of the display device such that the die is substantially insulated from transmission of residual stresses induced by or acting upon the support substrate. Methods of reducing residual stresses in LCD assemblies are also provided.

US Patent:

6357763, Mar 19, 2002

Filed:

Nov 4, 1998

Appl. No.:

09/186297

Inventors:

Ranjan J. Mathew - San Jose CA
Boonmi Mekdhanasarn - Sunnyvale CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 113

US Classification:

277628, 349155, 349190, 277233, 350160

Abstract:

The present invention provides an improved seal for sealing a liquid crystal display (LCD) device. An improved seal is formed between a transparent plate and a die having a pixel array. The improved seal is configured to encircle the pixel array of the die when the die and the transparent plate are joined. The die and the transparent plate are joined together such that the improved seal is disposed between the transparent plate and the die. In one embodiment, the improved seal is a hybrid seal. The hybrid seal includes a first seal encircling the pixel array of the die and adhesively coupling the transparent plate and the die. The hybrid seal further includes a second seal encircling the second seal. In another embodiment, the first seal lacks a characteristic necessary for an effective seal. The second seal possesses the characteristic, such that the hybrid seal possesses the necessary characteristic.

US Patent:

6384890, May 7, 2002

Filed:

Nov 15, 1999

Appl. No.:

09/440218

Inventors:

Hem P. Takiar - Fremont CA
Ranjan J. Mathew - San Jose CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 11345

US Classification:

349150, 349 8, 174254, 361749

Abstract:

A connection assembly ( ) for operably coupling a plurality of independent imaging devices ( ) to an optical subsystem ( ). The connection assembly ( ) includes a unitary flex circuit device ( ) having an elongated arm portion ( ), and a plurality independent finger portions ( ) extending from a distal end of the arm portion ( ). Each finger portion ( ) defines a coupling region ( ) adapted to operably couple a respective imaging device ( ) to a respective finger portion ( ) for support thereof. The finger portions ( ) are further adapted to strategically couple each respective imaging device ( ) to the optical subsystem ( ) as a unit. The flex circuit device ( ) includes a plurality of circuits ( ) terminating at respective terminals ( ) of a coupling region ( ) thereof. The terminals ( ) supportively and communicably coupled to the bond pads ( ) of the die ( ) for support thereof. The coupling region ( ) further includes an adhesive mount ( ) mounting the flex circuit device ( ) to the transparent plate to supportably suspend the display assembly ( ) between the die ( ) and the transparent plate ( ).

US Patent:

6459143, Oct 1, 2002

Filed:

Apr 26, 2001

Appl. No.:

09/844062

Inventors:

Inderjit Singh - San Jose CA
Hem P. Takiar - Fremont CA
Ranjan J. Mathew - San Jose CA
Nikhil V. Kelkar - Santa Clara CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

H01L 2358

US Classification:

257665, 257666, 257676, 257686, 257685, 257669

Abstract:

Improved methods of packaging external fuses together with integrated circuit devices are described. A pair of frame strips are provided that each have an associated set of contact pads. A resistor paste is applied to one of the contact pad sets and the frame strips are laminated together by curing the resistor paste which is positioned between the contact pad sets. Dice are mounted to the opposite sides of the second contact pads to form integrated circuit devices having integrally packaged external fuses. The packaged devices are eventually singulated for use. In some embodiments, the contact pads each have downturned tabs that form wings on opposite sides of each die. When the dice are flip chips, a device may be attached to a substrate board by soldering both the bumps on the die and the tab wing tips to the substrate board. In a preferred embodiment, the resistor paste is a positive temperature coefficient resistor paste.

US Patent:

6476885, Nov 5, 2002

Filed:

Jul 19, 1999

Appl. No.:

09/356482

Inventors:

G. Cade Murray - Fremont CA
Ranjan J. Mathew - San Jose CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 11333

US Classification:

349 60, 349150

Abstract:

A liquid crystal display package including a liquid crystal cell having a die with a pixel array, and a transparent plate attached to the die. A liquid crystal material is disposed in a gap region between the die and the transparent plate. The display assembly further includes a containment structure adapted to couple to and at least partially receive liquid crystal cell therein, and an electrical connector portion integrated with the containment structure. A plurality of conductive contacts are positioned in the containment structure for secured support thereof, and in substantially stress-free electrical connection with the pixel array. The conductive contacts further are configured to releasably couple to mating conductive contacts of an opposed electrical connector.

US Patent:

6498636, Dec 24, 2002

Filed:

Mar 30, 1999

Appl. No.:

09/281758

Inventors:

Ranjan J. Mathew - San Jose CA
G. Cade Murray - Fremont CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 113

US Classification:

349187, 349149, 349150, 349151, 349152

Abstract:

A connection assembly ( ) to electrically couple a transparent plate ( ) of a liquid crystal display device ( ) to an operating subsystem. The connection assembly ( ) includes an elongated flexible tape member ( ) having an elongated metallic circuit ( ) which further includes a main circuit portion ( ) fixedly mounted to the tape member ( ), and a lead terminal ( ). This terminal ( ) includes a contact portion ( ) adapted to electrically couple to the transparent plate ( ), and a substantially flexible and movable conductive joint portion ( ). The contact portion ( ) and the conductive joint portion ( ) electrically couple the transparent plate ( ) to the circuit portion ( ) of the metallic circuit ( ) in a manner substantially minimizing residual stresses formed from the electrical coupling between the transparent plate ( ) and the circuit portion ( ).

US Patent:

6556269, Apr 29, 2003

Filed:

Mar 7, 2002

Appl. No.:

10/094310

Inventors:

Hem P. Takiar - Fremont CA
Ranjan J. Mathew - San Jose CA

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

G02F 11345

US Classification:

349150

Abstract:

A connection assembly ( ) for operably coupling a plurality of independent imaging devices ( â) to an optical subsystem ( ). The connection assembly ( ) includes a unitary flex circuit device ( ) having an elongated arm portion ( ), and a plurality independent finger portions ( â) extending from a distal end of the arm portion ( ). Each finger portion ( â) defines a coupling region ( â) adapted to operably couple a respective imaging device ( â) to a respective finger portion ( â) for support thereof. The finger portions ( â) are further adapted to strategically couple each respective imaging device ( â) to the optical subsystem ( ) as a unit. The flex circuit device ( ) includes a plurality of circuits ( ) terminating at respective terminals ( ) of a coupling region ( ) thereof. The terminals ( ) supportively and communicably coupled to the bond pads ( ) of the die ( ) for support thereof. The coupling region ( ) further includes an adhesive mount ( ) mounting the flex circuit device ( ) to the transparent plate to supportably suspend the display assembly ( ) between the die ( ) and the transparent plate ( ).

US Patent:

6927156, Aug 9, 2005

Filed:

Jun 18, 2003

Appl. No.:

10/465171

Inventors:

Ranjan J. Mathew - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L021/44

US Classification:

438612, 438614, 438617, 438622

Abstract:

A method and apparatus for making pad structures suitable for wirebonding and, optionally, also for solder-ball connections. Some embodiments include an electronics chip having a substrate with circuitry, a compliant electrically insulating layer deposited on at least a portion of the substrate, and an electrical connection pad, the pad having an electrical connection to the circuitry through an aperture in the insulating layer and a peripheral bonding zone region extending over the insulating layer. In some embodiments, the bonding zone is exclusively over the insulating layer outside of the aperture. In some embodiments, the pads are suitable for both solder-ball and wirebond connections. By making a wirebond connection to an area of a pad over the compliant insulating layer, the underlying circuitry is protected from ultrasonic energy of the bonding process.