Shu-Jen Han - Cortlandt Manor NY, US Yu-Ming Lin - West Harrison NY, US Yanqing Wu - Ossining NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03K 19/02
US Classification:
326135, 977734
Abstract:
A circuit includes a negative differential resistance (NDR) device which includes a gate and a graphene channel, and a gate voltage source which modulates a gate voltage on the gate such that an electric current through the graphene channel exhibits negative differential resistance.
Peide Ye - West Lafayette IN, US Zhiyuan Cheng - Lincoln MA, US Yi Xuan - West Lafayette IN, US Yanqing Wu - West Lafayette IN, US Bunmi Adekore - Medford MA, US James Fiorenza - Wilmington MA, US
Assignee:
AmberWave Systems Corporation - Salem NH Purdue Research Foundation - West Lafayette IN
International Classification:
H01L 21/335 H01L 21/336
US Classification:
438172, 438285, 257E21409, 257E21403
Abstract:
Methods of forming structures that include InP-based materials, such as a transistor operating as an inversion-type, enhancement-mode device. A dielectric layer may be deposited by ALD over a semiconductor layer including In and P. A channel layer may be formed above a buffer layer having a lattice constant similar to a lattice constant of InP, the buffer layer being formed over a substrate having a lattice constant different from a lattice constant of InP.
Graphene Devices And Semiconductor Field Effect Transistors In 3D Hybrid Integrated Circuits
A three-dimensional integrated circuit includes a semiconductor device, an insulator formed on the semiconductor device, an interconnect formed in the insulator, and a graphene device formed on the insulator.
Taiwan Semiconductor Manufacturing Company - Hsin-Chu, TW Zhiyuan Cheng - Lincoln MA, US Yi Xuan - West Lafayette IN, US Yanqing Wu - West Lafayette IN, US Bunmi Adekore - Medford MA, US James Fiorenza - Wilmington MA, US
Methods of forming structures that include InP-based materials, such as a transistor operating as an inversion-type, enhancement-mode device. A dielectric layer may be deposited by ALD over a semiconductor layer including In and P. A channel layer may be formed above a buffer layer having a lattice constant similar to a lattice constant of InP, the buffer layer being formed over a substrate having a lattice constant different from a lattice constant of InP.
Jin Cai - Cortlandt Manor NY, US Yanqing Wu - Ossining NY, US Wenjuan Zhu - Fishkill NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 29/06 H01L 21/02 B82Y 40/00
US Classification:
257 9, 438 50, 257E29005, 257E21002, 977734
Abstract:
Semiconductor nano pressure sensor devices having graphene membrane suspended over cavities formed in a semiconductor substrate. A suspended graphene membrane serves as an active electro-mechanical membrane for sensing pressure, which can be made very thin, from about one atomic layer to about 10 atomic layers in thickness, to improve the sensitivity and reliability of a semiconductor pressure sensor device.
Jin Cai - Cortlandt Manor NY, US Yanqing Wu - Ossining NY, US Wenjuan Zhu - Fishkill NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 29/02
US Classification:
438 50, 257E29002
Abstract:
Semiconductor nano pressure sensor devices having graphene membrane suspended over open cavities formed in a semiconductor substrate. A suspended graphene membrane serves as an active electro-mechanical membrane for sensing pressure, which can be made very thin, from about one atomic layer to about 10 atomic layers in thickness, to improve the sensitivity and reliability of a semiconductor pressure sensor device.
- Hsinchu, TW - WEST LAFAYETTE IN, US Yi Xuan - West Lafayette IN, US Yanqing Wu - West Lafayette IN, US Bunmi Adekore - Medford MA, US James Fiorenza - Wilmington MA, US
Methods of forming structures that include InP-based materials, such as a transistor operating as an inversion-type, enhancement-mode device are disclosed. A dielectric layer may be deposited by ALD over a semiconductor layer including In and P. A channel layer may be formed above a buffer layer having a lattice constant similar to a lattice constant of InP, the buffer layer being formed over a substrate having a lattice constant different from a lattice constant of InP.
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