William H Rohling

US Patent:

52571785, Oct 26, 1993

Filed:

Dec 19, 1991

Appl. No.:

7/810793

Inventors:

William T. Hatfield - Schenectady NY
William W. Rohling - Scotia NY
Wolfgang Daum - Schenectady NY
Carl L. Chalek - Scotia NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

G05B 1918

US Classification:

364191

Abstract:

A method for optimally operating a computer numerical control (CNC) milling machine to form cavities in a ceramic substrate for receiving IC chips and other components of a high density interconnect structure electrically interconnected by a multi-layer interconnect (HDI) structure. Generation of the CNC program instructions is based on locations and dimensions of the components which, through a set of design rules, provide locations and dimensions for an initial set of cavities corresponding to the components on a one-for-one basis. Depending upon the particular arrangement of the components, specific neighboring cavities of the initial set may either overlap or be separated by walls. A representation of the location and dimensions of each of the cavities of the initial set is formed, and the representation is enhanced by a "combine pockets" step and by a "remove borders" step to represent locations and dimensions of cavities of an optimized set. CNC program instructions for the milling machine are then generated for forming the cavities of the optimized set.