A ball bump is formed on a semiconductor die (12) by lowering a capillary (18) and a conductive wire (20) having a ball (30) formed at its end toward the die. The ball is pressed against a bond pad (14) of the die to form a ball bond (32). The capillary is then raised and horizontally displaced without breaking the wire. The capillary is then lowered such that one side of a bottom face (22) of the capillary is used to flatten the ball bond to form a flattened ball bump (38). In lowering the capillary, an entire width (W) of the bottom face lies over and is in contact with the entire top surface of the ball bump, and a chamfer (26) and feed hole (24) are located at or beyond a perimeter of the ball bump. The wire is then clamped and the capillary raised to break the wire from the ball bump.
Ryder Integrated Logistics since May 2008
Supply Chain Excellence Account Manager (AMAT)
Dell Managed Services Jun 2006 - Jun 2007
Champion - Process Improvement and Quality Management Systems
Dell Nov 2003 - May 2006
Global Service Program Manager
Motorola Feb 2000 - Oct 2003
Technical Manager-Business Analysis
Education:
The University of Texas at Austin 1988 - 1990
MS, Engineering
Skills:
Six Sigma Business Process Improvement Cross Functional Team Leadership Process Improvement Business Process Change Management Manufacturing Supply Chain Management Supply Chain Strategy Quality Management Process Engineering Continuous Improvement Leadership Mentoring Lean Transformation Project Management Management