Timothy Lavern Weber

Author:

Timothy Weber

ISBN #:

0785280847

Author:

Timothy T. Weber

ISBN #:

0898620686

Author:

Timothy P. Weber

ISBN #:

0226877329

Author:

Timothy P. Weber

ISBN #:

0310440912

Author:

Timothy P. Weber

ISBN #:

0801031427

Author:

Timothy P. Weber

ISBN #:

0882077635

US Patent:

6336714, Jan 8, 2002

Filed:

Aug 27, 1999

Appl. No.:

09/384817

Inventors:

Naoto A. Kawamura - Corvallis OR
Colin C. Davis - Corvallis OR
Timothy L. Weber - Corvallis OR
Kenneth E. Trueba - Philomas OR
John Paul Harmon - Albany OR
David R. Thomas - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 205

US Classification:

347 65

Abstract:

Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. The trench completely etches away portions of the substrate near the ink feed holes so that the thin film layers form a shelf in the vicinity of the ink feed holes. In one embodiment, the shelf supports the ink ejection elements. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers.

US Patent:

6354694, Mar 12, 2002

Filed:

Feb 19, 1999

Appl. No.:

09/252737

Inventors:

Timothy L. Weber - Corvallis OR
John P. Harmon - Albany OR
S. Dana Seccombe - Foster City CA
Colin C. Davis - Corvallis OR
Paul J. McClellan - Salem OR
David J. Waller - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 214

US Classification:

347 48, 347 47

Abstract:

A method and apparatus for improving ink-jet print quality uses a print head having an array using a plurality of nozzles in sets in each drop generator mechanism. Where a conventional ink-jet pen fires a single droplet of ink at a pixel per firing cycle, the present invention fires a plurality of droplets at different subdivisions of pixels. The particular array design may vary from ink-to-ink or pen-to-pen. Each drop generator of a print head array includes a plurality of nozzles wherein each of the nozzles has an exit orifice with an areal dimension, and produces an ink droplet that produces a dot on adjacent print media wherein the dot has an areal dimension, less than the areal dimension of a pixel to be printed. Dots are printed in a pattern for each pixel wherein print quality is achieved that approximates a higher resolution print made by conventional ink-jet methodologies.

US Patent:

6371596, Apr 16, 2002

Filed:

Aug 30, 1999

Appl. No.:

09/386580

Inventors:

Robert C. Maze - Corvallis OR
Timothy L Weber - Corvallis OR
Arun K Agarwal - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 214

US Classification:

347 47

Abstract:

A printhead having reduced spray includes orifi from which ink is expelled by an ink ejector. The orifi employ an aperture at the outer surface of the orifice plate having an asymmetrical hourglass shape to cause the expelled ink drop to break off at the narrow end of the orifice aperture.

US Patent:

6402972, Jun 11, 2002

Filed:

May 19, 1999

Appl. No.:

09/314551

Inventors:

Timothy L. Weber - Corvallis OR
Kenneth E. Trueba - Barcelona, ES
John Paul Harmon - Albany OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 204

US Classification:

216 27, 438 21, 347 65, 347 68

Abstract:

An ink jet print head having a substrate with an upper surface, and an ink supply conduit passing through the substrate. An array of independently addressable ink energizing elements are attached to the upper surface of the substrate. An orifice layer has a lower surface conformally connected to the upper surface of the substrate, and has an exterior surface facing away from the substrate. The orifice layer defines a plurality of firing chambers providing communication to the ink energizing elements, and each of the orifices is positioned in registration with a respective single ink energizing element. The exterior surface defines a plurality of nozzle apertures, each providing the upper terminus of a single firing chamber. Each of the firing chambers is laterally separated from all other firing chambers by a septum portion of the orifice layer.

US Patent:

6412901, Jul 2, 2002

Filed:

Apr 24, 2001

Appl. No.:

09/841386

Inventors:

Wen-Li Su - Vancouver WA
Trudy L. Benjamin - Portland OR
Steven B. Elgee - Portland OR
Thomas F. Uhling - Vancouver WA
Bruce A. Axten - Vancouver WA
Kerry J. Lundsten - Vancouver WA
Xiuting C. Man - Vancouver WA
Tamara L. Hahn - San Diego CA
Michael T. Dangelo - San Diego CA
Bryan D. Woll - Poway CA
Timothy L. Weber - Corvallis OR
James W Pearson - Corvallis OR
Iue-Shuenn Chen - San Diego CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 29393

US Classification:

347 19, 347 35

Abstract:

A monitoring system monitors a pressure wave developed in the surrounding ambient environment during inkjet droplet formation. The monitoring system uses either acoustic, ultrasonic, or other pressure wave monitoring mechanisms, such as a laser vibrometer, an ultrasonic transducer, or an accelerometer sensor, for instance, a microphone to detect droplet formation. One sensor is incorporated in the printhead itself, while others may be located externally. The monitoring system generates information used to determine current levels of printhead performance, to which the printer may respond by adjusting print modes, servicing the printhead, adjusting droplet formation, or by providing an early warning before an inkjet cartridge is completely empty. During printhead manufacturing, an array of such sensors may be used in quality assurance to determine printhead performance. An inkjet printing mechanism is also equipped for using this monitoring system, and a monitoring method is also provided.

US Patent:

6435653, Aug 20, 2002

Filed:

Oct 5, 2001

Appl. No.:

09/972648

Inventors:

Melissa D Boyd - Corvallis OR
Timothy E Beerling - Corvallis OR
Timothy L Weber - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 205

US Classification:

347 42, 347 58, 347 86, 347 85

Abstract:

An inkjet pen includes a multilayered platform, an electrical interconnection extending through the multilayered platform, and a plurality of printhead dies each mounted on the multilayered platform. The multilayered platform includes a first layer having an ink inlet defined therein, a second layer having a plurality of ink feed slots defined therein, and at least one third layer having an ink manifold defined therein. The ink manifold of the at least one third layer fluidically couples the ink inlet of the first layer with the ink feed slots of the second layer. Each of the printhead dies are mounted on the second layer of the multilayered platform and include an array of printing elements and an ink refill slot communicating with the array of printing elements. The ink refill slot of each of the printhead dies communicates with at least one of the ink feed slots of the multilayered platform, and each of the printhead dies are electrically coupled to the electrical interconnection.

US Patent:

6502918, Jan 7, 2003

Filed:

Aug 29, 2001

Appl. No.:

09/942475

Inventors:

Richard W Seaver - Corvallis OR
Timothy L Weber - Corvallis OR
James A Mott - San Diego CA
Dustin W Blair - San Diego CA
Charles C Haluzak - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 215

US Classification:

347 20, 347 67

Abstract:

A fluid ejection device has a firing chamber with a feature disposed therewithin.

US Patent:

6508536, Jan 21, 2003

Filed:

Mar 8, 2000

Appl. No.:

09/521872

Inventors:

Timothy E. Beerling - Corvallis OR
Timothy L. Weber - Corvallis OR
Melissa D. Boyd - Corvallis OR

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

B41J 2155

US Classification:

347 42, 347 50, 298901

Abstract:

A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.