Thomas E Kindl from Youngsville, NC, age 72

Us Patents

Fabrication Of A Metalized Blind Via
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US Patent:

6522014, Feb 18, 2003
Filed:

Sep 27, 2000
Appl. No.:

09/670968
Inventors:

Frank D. Egitto - Binghamton NY
Elizabeth Foster - Friendsville PA
Raymond T. Galasco - Binghamton NY
David E. Houser - Apalachin NY
Mark L. Janecek - Endicott NY
Thomas E. Kindl - Endwell NY
Jeffrey A. Knight - Endwell NY
Stephen W. MacQuarrie - Vestal NY
Voya R. Markovich - Endwell NY
Luis J. Matienzo - Endicott NY
Amarjit S. Rai - Vestal NY
David J. Russell - Apalachin NY
William T. Wike - Endicott NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H01L 2348
US Classification:

257774, 438639, 438677
Abstract:

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e. g. , copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

Fabrication Of A Metalized Blind Via
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US Patent:

6576549, Jun 10, 2003
Filed:

Oct 28, 2002
Appl. No.:

10/282275
Inventors:

Frank D. Egitto - Binghamton NY
Elizabeth Foster - Friendsville PA
Raymond T. Galasco - Binghamton NY
David E. Houser - Apalachin NY
Mark L. Janecek - Endicott NY
Thomas E. Kindl - Endwell NY
Jeffrey A. Knight - Endwell NY
Stephen W. MacQuarrie - Vestal NY
Voya R. Markovich - Endwell NY
Luis J. Matienzo - Endicott NY
Amarjit S. Rai - Vestal NY
David J. Russell - Apalachin NY
William T. Wike - Endicott NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H01L 2131
US Classification:

438678, 257774, 438639, 438675, 438677
Abstract:

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e. g. , copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

Method Of Bonding Flexible Circuit To Cicuitized Substrate To Provide Electrical Connection Therebetween Using Different Solders
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US Patent:

52030750, Apr 20, 1993
Filed:

Aug 12, 1991
Appl. No.:

7/743970
Inventors:

Christopher G. Angulas - Endicott NY
Patrick T. Flynn - Owego NY
Joseph Funari - Vestal NY
Thomas E. Kindl - Endwell NY
Randy L. Orr - Vesal NY
Assignee:

Inernational Business Machines - Armonk NY
International Classification:

H05K 336
US Classification:

29830
Abstract:

A method of bonding a flexible circuitized substrate to a circuitized substrate (e. g. , printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e. g. , epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e. g. , in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.

Method For Bonding Flexible Circuit To Circuitized Substrate To Provide Electrical Connection Therebetween Using Different Solders
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US Patent:

52611558, Nov 16, 1993
Filed:

Feb 5, 1993
Appl. No.:

8/014291
Inventors:

Christopher G. Angulas - Endicott NY
Patrick T. Flynn - Owego NY
Joseph Funari - Vestal NY
Thomas E. Kindl - Endwell NY
Randy L. Orr - Vestal NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H05K 336
US Classification:

29830
Abstract:

A method of bonding a flexible circuitized substrate to a circuitized substrate (e. g. , printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e. g. , epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e. g. , in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.

Electronic Package And Method Of Making Same
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US Patent:

52787249, Jan 11, 1994
Filed:

Jul 6, 1992
Appl. No.:

7/909520
Inventors:

Christopher G. Angulas - Johnson City NY
Thomas E. Kindl - Endwell NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H05K 720
US Classification:

361 707
Abstract:

An electronic package and method of making same wherein the package includes a first substrate (e. g. , printed circuit board), a second, flexible circuitized substrate (e. g. , polyimide dielectric with conductors thereon) having a semiconductor device (chip) electrically coupled thereto. The outer portions of the flexible circuitized substrate are wrapped about the frame which in turn includes portions thereof which serve to spacedly position the wrapped flexible substrate with respect to the first substrate such that conductors on both substrates may be precisely aligned and electrically coupled in a permanent manner. A method of assembling the invention, including the use of a vacuum head and appropriate heat thermodes, is also defined.

Method For Forming A Patterned Layer On A Substrate
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US Patent:

53344871, Aug 2, 1994
Filed:

Jul 23, 1992
Appl. No.:

7/918989
Inventors:

Thomas E. Kindl - Endwell NY
Ronald J. Moore - Binghamton NY
Paul G. Rickerl - Endicott NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

G03F 700
US Classification:

430312
Abstract:

The present invention provides a method of forming a pattern of conductive material on dielectric material with access openings or vias through said dielectric material and such a structure. A sheet of conductive material, which is to be circuitized, is provided with a layer of a first photoimageable dielectric material on one face thereof. A layer of a second photoimageable material, such as a conventional photoresist material, is provided on the opposite face of the conductive material. The layer of said first photoimageable material is selected such that it will not be developed by the developer that develops the layer of said second material. The two layers of photoimageable material are pattern-wise exposed to radiation. The second layer of material is developed and the revealed underlying conductive material is etched to form the desired circuit pattern. The first layer is then developed to form openings or vias communicating with the circuit pattern, and these are then filled with a conductive material such as solder.

Method Of Etching Polyimides And Resulting Passivation Structure
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US Patent:

49117866, Mar 27, 1990
Filed:

Apr 26, 1989
Appl. No.:

7/343217
Inventors:

Thomas E. Kindl - Endwell NY
Paul G. Rickerl - Endicott NY
David J. Russell - Apalachin NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

B44C 122
B29C 3700
C03C 1500
C23F 102
US Classification:

1566591
Abstract:

A method of etching polyimide having metallization patterned thereon in which an epoxy resin system provides the etch mask for etching the polyimide and provides a resulting passivation structure overlying the metallization. The polyimide having a metallization pattern thereon is coated with the photoimageable material resists concentrated KOH etching when the epoxy is cured and adheres to the polyimide and the metallized pattern after the KOH etch providing passivation to the metallization. The process includes exposing the layer of photoimageable material to radiation to selectively pattern the material, developing the patterned material revealing the underlying polyimide to be etched, curing the remaining material and etching the revealed polyimide in concentrated KOH to remove the revealed polyimide. The remaining epoxy firmly adheres as a passivation layer for the metallization. Preferably the epoxy consists by weight essentially of from about 10% to about 80% of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 to 130,00, and between about 20% and 90% of an epoxidized octafunctional bisphenol A formaldehyde novolak resin, having a molecular weight of between 4,000 to 10,000 and about 0.

Flexible Circuit Member
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US Patent:

54357322, Jul 25, 1995
Filed:

Aug 11, 1994
Appl. No.:

8/289338
Inventors:

Christopher G. Angulas - Endicott NY
Patrick T. Flynn - Owego NY
Joseph Funari - Vestal NY
Thomas E. Kindl - Endwell NY
Randy L. Orr - Vestal NY
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

H05K 111
H05K 336
H01R 909
US Classification:

439 67
Abstract:

A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circuitized substrate being secured thereto.