Shen S Peng

US Patent:

20230009651, Jan 12, 2023

Filed:

Nov 23, 2020

Appl. No.:

17/780011

Inventors:

- Fremont CA, US
Dan Marohl - San Jose CA, US
Shen Peng - Dublin CA, US

International Classification:

H01J 37/32
H03H 7/38
H01F 27/28

Abstract:

Systems and methods for using a transformer to achieve uniformity in processing a substrate are described. One of the systems includes a primary winding having a first end and a second end. The first end is coupled to an output of an impedance matching circuit and the second end is coupled to a capacitor. The system further includes a secondary winding associated with the primary winding and coupled to a first end and a second end of a transformer coupled plasma (TCP) coil of a plasma chamber. The primary winding receives a modified radio frequency (RF) signal from the impedance matching circuit to generate a magnetic flux to induce a voltage in the secondary winding. An RF signal generated by the voltage is transferred from the secondary winding to the TCP coil.

US Patent:

20210305017, Sep 30, 2021

Filed:

Mar 26, 2021

Appl. No.:

17/214741

Inventors:

- Fremont CA, US
Craig Rosslee - San Jose CA, US
Shen Peng - Dublin CA, US
James Chris Vetter - Pine Grove CA, US

International Classification:

H01J 37/32

Abstract:

A system for heating a dielectric window of a plasma processing chamber is provided. In one example, the method includes the use of a heating element. The heating element includes a dielectric disc and a conductive line formed in the dielectric disc. The conductive line includes a plurality of loops oriented radially around the dielectric disc. Each loop extends from a radial periphery of the dielectric disc toward a center of the dielectric disc. Each loop of the conductive line has an inward segment coupled to a return segment by a switchback segment. The inward segment is vertically aligned with the return segment.

US Patent:

20180366301, Dec 20, 2018

Filed:

Jun 14, 2017

Appl. No.:

15/623356

Inventors:

- Fremont CA, US
Shen Peng - Dublin CA, US
David Setton - Danville CA, US
Craig Rosslee - San Jose CA, US
Dan Marohl - San Jose CA, US
Andras Kuthi - Thousand Oaks CA, US

International Classification:

H01J 37/32
H01F 27/29
H03H 7/38
H01F 41/06
H01F 27/24
H03H 3/00

Abstract:

A coil portion is formed. A first articulation portion extends from the coil portion. A first mounting structure extends from the first articulation portion. The first mounting structure includes a first mounting region configured to mount in contact with a terminal of a first electrical component. The first articulation portion and the first mounting structure are configured to position the first mounting region at a location outside of a strong electromagnetic field emanating from the coil portion. A second articulation portion extends from the coil portion. A second mounting structure extends from the second articulation portion. The second mounting structure includes a second mounting region configured to mount in contact with a terminal of a second electrical component. The second articulation portion and the second mounting structure are configured to position the second mounting region at a location outside of the strong electromagnetic field emanating from the coil portion.

US Patent:

20180217185, Aug 2, 2018

Filed:

Jan 30, 2017

Appl. No.:

15/419986

Inventors:

- Fremont CA, US
Shen Peng - Dublin CA, US
Jimmy Nguyen - San Jose CA, US

International Classification:

G01R 15/18
H05K 1/02
H05K 1/18
H01F 27/28
H01J 37/32

Abstract:

A first inductive loop is formed within a printed circuit board (PCB). The PCB is mounted in a fixed spatial relationship with a radiofrequency power supply structure. A second inductive loop is formed within the PCB. The second inductive loop is positioned in fixed spatial relationship with the first inductive loop such that a distance between the centerpoints of the first and second inductive loops has a fixed value and is precisely known. Each of the first and second inductive loops is formed in an essentially identical manner with regard to number of complete turns of the loops and a size of the loops. A first voltage signal present on the first inductive loop and a second voltage signal present on the second inductive loop and the distance between the first and second loops provide for determination of a radiofrequency current present on the radiofrequency power supply structure.

US Patent:

20180047543, Feb 15, 2018

Filed:

Aug 8, 2017

Appl. No.:

15/671867

Inventors:

- Fremont CA, US
Dan Marohl - San Jose CA, US
Shen Peng - Dublin CA, US
Gautam Bhattacharyya - San Ramon CA, US
Andras Kuthi - Thousand Oaks CA, US

International Classification:

H01J 37/32

Abstract:

A system is provided and includes a first linear motor, a first separator support assembly, and a controller. The first linear motor includes a shaft that is linearly driven based on a current supplied to the first linear motor. The first separator support assembly is configured to connect to the shaft of the first linear motor and to a rod of a first capacitor of a match network. The first linear motor is configured to actuate the rod to move a first electrode of the first capacitor relative to a second electrode of the first capacitor to change a capacitance of the first capacitor. The controller is connected to the first linear motor and is configured to adjust power supplied to a first radio frequency reactor coil of a plasma processing chamber by adjusting the current supplied to the first linear motor.