Santosh K Bhattacharyya

US Patent:

7747062, Jun 29, 2010

Filed:

Nov 9, 2005

Appl. No.:

11/270771

Inventors:

Da Chen - San Jose CA, US
Christophe Fouquet - Sunnyvale CA, US
Saibal Banerjee - Fremont CA, US
Santosh Bhattacharyya - San Jose CA, US
Joe Wang - Sunnyvale CA, US
Lian Yao - Woodridge IL, US
Mike van Riet - Morgan Hill CA, US
Igor Germanenko - San Jose CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G06K 9/00

US Classification:

382145, 382141

Abstract:

Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.

US Patent:

7756658, Jul 13, 2010

Filed:

May 14, 2008

Appl. No.:

12/120574

Inventors:

Ashok Kulkarni - San Jose CA, US
Santosh Bhattacharyya - San Jose CA, US

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

G01N 37/00

US Classification:

702 83, 702 35, 702183, 3562371

Abstract:

Systems and methods for detecting defects on a wafer and generating inspection results for the wafer are provided. One method includes detecting defects on a wafer by comparing output generated by scanning of the wafer performed by an inspection system to one or more defect detection thresholds. The method also includes sampling outliers in the output by selecting the output having the highest values from bins defined based on one or more predetermined criteria. In addition, the method includes selecting a portion of the sampled outliers based on wafer-level analysis of the sampled outliers. The method further includes generating inspection results for the wafer by combining information about the selected portion of the sampled outliers with information about the defects detected using the one or more defect detection thresholds.

US Patent:

7796804, Sep 14, 2010

Filed:

Jul 18, 2008

Appl. No.:

12/176095

Inventors:

Kris Bhaskar - San Jose CA, US
Mark McCord - Mountain View CA, US
Santosh Bhattacharyya - San Jose CA, US
Ardis Liang - Fremont CA, US
Richard Wallingford - San Jose CA, US
Hubert Altendorfer - Redwood Shores CA, US
Kais Maayah - San Jose CA, US

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

G06K 9/00

US Classification:

382145, 382103

Abstract:

Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.

US Patent:

8126255, Feb 28, 2012

Filed:

Sep 19, 2008

Appl. No.:

12/234201

Inventors:

Kris Bhaskar - San Jose CA, US
Chetana Bhaskar - San Jose CA, US
Ashok Kulkarni - San Jose CA, US
Eliezer Rosengaus - Palo Alto CA, US
Cecelia Campochiaro - Sunnyvale CA, US
Chris Maher - Campbell CA, US
Brian Duffy - San Jose CA, US
Aneesh Khullar - Sunnyvale CA, US
Alpa Kohli - Saratoga CA, US
Lalita A. Balasubramanian - Fremont CA, US
Santosh Bhattacharyya - San Jose CA, US
Mohan Mahadevan - Livermore CA, US

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

G06K 9/00

US Classification:

382141, 382145, 382154

Abstract:

Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.

US Patent:

8204296, Jun 19, 2012

Filed:

Sep 14, 2010

Appl. No.:

12/881669

Inventors:

Kris Bhaskar - San Jose CA, US
Mark McCord - Mountain View CA, US
Santosh Bhattacharyya - San Jose CA, US
Ardis Liang - Fremont CA, US
Richard Wallingford - San Jose CA, US
Hubert Altendorfer - Redwood Shores CA, US
Kais Maayah - San Jose CA, US

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

G06K 9/00

US Classification:

382145, 382103, 382149

Abstract:

Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.

US Patent:

20130064442, Mar 14, 2013

Filed:

Aug 31, 2012

Appl. No.:

13/601891

Inventors:

Ellis Chang - Saratoga CA, US
Michael J. Van Riet - Sunnyvale CA, US
Allen Park - San Jose CA, US
Khurram Zafar - San Jose CA, US
Santosh Bhattacharyya - San Jose CA, US

Assignee:

KLA-TENCOR CORPORATION - Milpitas CA

International Classification:

G06K 9/62

US Classification:

382149

Abstract:

Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects.

US Patent:

7440607, Oct 21, 2008

Filed:

Nov 3, 2004

Appl. No.:

10/980499

Inventors:

Jason Z. Lin - Saratoga CA, US
Hong Chen - San Ramon CA, US
Evgeni Shifrin - Sunnyvale CA, US
Ashok V. Kulkarni - San Jose CA, US
Santosh K. Bhattacharyya - San Jose CA, US
Wei Zhao - Sunnyvale CA, US

Assignee:

KLA-Tencor Corporation - San Jose CA

International Classification:

G06K 9/00

US Classification:

382149

Abstract:

A method of detecting anomalies in a test image. Test features of pixels within the test image are selected, and reference features of pixels within at least one reference image are also selected. A signal distribution of test features and reference features in a multi-dimensional feature space is created, and stored. Those test features of the test image that do not satisfy a set of criteria for normalcy are selected as candidate points. Those candidate points that are statistical outliers are identified as anomalies. Positions of the anomalies are located using the stored signal distribution within which the defects have been identified as a lookup table.

US Patent:

20200126212, Apr 23, 2020

Filed:

Mar 25, 2019

Appl. No.:

16/364161

Inventors:

- Milpitas CA, US
Martin Plihal - Pleasanton CA, US
Santosh Bhattacharyya - San Jose CA, US
Gordon Rouse - Dublin CA, US
Chris Maher - San Jose CA, US
Erfan Soltanmohammadi - San Jose CA, US

International Classification:

G06T 7/00
H01L 21/66
G06T 7/11
G01R 31/308
G03F 7/20

Abstract:

Methods and systems for setting up inspection of a specimen with design and noise based care areas are provided. One system includes one or more computer subsystems configured for generating a design-based care area for a specimen. The computer subsystem(s) are also configured for determining one or more output attributes for multiple instances of the care area on the specimen, and the one or more output attributes are determined from output generated by an output acquisition subsystem for the multiple instances. The computer subsystem(s) are further configured for separating the multiple instances of the care area on the specimen into different care area sub-groups such that the different care area sub-groups have statistically different values of the output attribute(s) and selecting a parameter of an inspection recipe for the specimen based on the different care area sub-groups.