Ryan Herbert Jones

US Patent:

7458274, Dec 2, 2008

Filed:

Feb 20, 2007

Appl. No.:

11/708851

Inventors:

Wayne A. Lamb - London OH, US
Ryan S. Jones - Dublin OH, US
Marsha M. Martin - Columbus OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01L 7/00
H01R 12/00

US Classification:

73756, 439 79

Abstract:

A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

US Patent:

7775126, Aug 17, 2010

Filed:

Oct 22, 2008

Appl. No.:

12/256181

Inventors:

Todd Eckhardt - Westerville OH, US
Richard Wade - Worthington OH, US
Ryan Jones - Dublin OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01F 1/37
A61M 31/00

US Classification:

7386152, 7386147, 604 9301, 604131, 604246

Abstract:

A differential force sensor method and apparatus for automatically monitoring manual injections through an intravenous line. The differential force sensor includes two piezoresistive sense die that are packaged in close proximity utilizing a number of packaging processes. The two piezoresistive sense die can be utilized to measure forces exerted on a diaphragm on either side of an orifice. The piezoresistive sense die can be packaged in close proximity to make intimate contact with the diaphragms on either side of the orifice. The differential force sensor further includes two plungers that make intimate contact with the diaphragm and transfer the force into the piezo-resistive sense dies. Additionally, one or more ASICs and microcontrollers can be utilized to provide thermal calibration and differential calculation.

US Patent:

8091436, Jan 10, 2012

Filed:

Jul 12, 2010

Appl. No.:

12/834321

Inventors:

Todd Eckhardt - Westerville OH, US
Richard Wade - Worthington OH, US
Ryan Jones - Dublin OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01F 1/37
A61M 31/00

US Classification:

7386152, 7386147, 604 9301, 604 67, 604505

Abstract:

A differential force sensor method and apparatus for automatically monitoring manual injections through an intravenous line. The differential force sensor includes two piezoresistive sense die that are packaged in close proximity utilizing a number of packaging processes. The two piezoresistive sense die can be utilized to measure forces exerted on a diaphragm on either side of an orifice. The piezoresistive sense die can be packaged in close proximity to make intimate contact with the diaphragms on either side of the orifice. The differential force sensor further includes two plungers that make intimate contact with the diaphragm and transfer the force into the piezo-resistive sense dies. Additionally, one or more ASICs and microcontrollers can be utilized to provide thermal calibration and differential calculation.

US Patent:

8327715, Dec 11, 2012

Filed:

Jul 2, 2009

Appl. No.:

12/497299

Inventors:

Alistair David Bradley - Dublin OH, US
Todd Eckhardt - Westerville OH, US
Ryan Jones - Dublin OH, US
Richard Wade - Worthington OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01B 7/16
G01L 1/00

US Classification:

73774, 73777

Abstract:

A force sensor apparatus and method of forming the same. The apparatus includes a force sense element that can be attached to a substrate. An actuator disposed in a hole formed within the cap is operably coupled to the force sense element for transferring force to the sense element in response to receiving a force from an external source. The force sense element is configured to sense the external force and generate an output signal representing the force. Preferably, one or more bond pads, associated with the force sense element and the substrate, can be electrically connected via wire bonding. A cover associated with an integrated flexible membrane can be mounted on the substrate in order to protect internal components associated with the force sensor apparatus from an external environment.

US Patent:

8446220, May 21, 2013

Filed:

May 9, 2011

Appl. No.:

13/103913

Inventors:

Paul Rozgo - Dublin OH, US
Ryan Jones - Dublin OH, US
Lamar Floyd Ricks - Lewis Center OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H03F 1/00

US Classification:

330174, 324251

Abstract:

Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e. g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e. g. 3. 5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e. g. across a sub-range of 3. 0 to 4. 0 VDC for a current operating point of 3. 5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal. In some cases, this may allow for a smaller and/or cheaper sensor to be used, while still achieving good results.

US Patent:

8459125, Jun 11, 2013

Filed:

Aug 1, 2011

Appl. No.:

13/195756

Inventors:

Richard A. Wade - Worthington OH, US
Ryan Jones - Dublin OH, US
Todd Eckhardt - Westerville OH, US
James A. Machir - Columbus OH, US
Ian Bentley - New Ipswich NH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01L 9/00
G01L 7/00

US Classification:

73753, 73756

Abstract:

The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In some instances, the sensor unit may include pressure signal output terminals electrically connected to electrical terminals of the electrical connector.

US Patent:

8516897, Aug 27, 2013

Filed:

Feb 21, 2012

Appl. No.:

13/401727

Inventors:

Ryan Jones - Dublin OH, US
Paul Rozgo - Dublin OH, US
Richard Charles Sorenson - Columbus OH, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

G01L 7/00
H01L 27/14
H01L 21/02

US Classification:

73754, 73756, 438 51, 257414, 257417

Abstract:

The present disclosure relates to pressure sensor assemblies and methods. The pressure sensor assembly may include a first substrate, a second substrate and a sense die. The first substrate may be connected to the second substrate, such that an aperture in the first substrate is in fluid communication with an aperture in the second substrate. The second substrate may be connected to the sense die, such that the aperture in the second substrate is in fluid communication with a sense diaphragm on the second substrate. The pressure sensor assembly may include a media path that extends through the aperture in the first substrate, through the aperture in the second substrate, and to the sense die. In some cases, the first substrate, the second substrate and the sense die may be connected in a manner that does not include an adhesive.

US Patent:

20120290268, Nov 15, 2012

Filed:

May 9, 2011

Appl. No.:

13/103891

Inventors:

Paul Prehn Bey - Gahanna OH, US
Bill Hoover - Plain City OH, US
Jamie Speldrich - Freeport IL, US
Ryan Jones - Dublin OH, US

Assignee:

HONEYWELL INTERNATIONAL INC. - Morristown NJ

International Classification:

G06F 15/00

US Classification:

702189

Abstract:

A modular sensor assembly in which a sensing module may be packaged and provided separately from a signal processing module and which, in some applications, may facilitate disposal and/or replacement of the sensing module when exposed to a “dirty” or “contaminated” environment without requiring disposal and/or replacement of the entire sensor assembly. In certain applications, the sensing module may include at least one transducer or sensor and a local memory containing a set of conditioning coefficients. The sensing module may be removably coupled to a signal processing module which, in some cases, may be configured to download the set of conditioning coefficients stored in the local memory of the sensing module, and to use the set of conditioning coefficients to produce a substantially linearized output signal.