Start-Up
Co-Founder
Pdf Solutions Jan 2013 - Nov 2013
Advanced Technology Dfm and Doe Engineer
Aixtron Se Apr 2010 - Dec 2012
Senior Process Engineer
Stanford University Jul 2009 - Mar 2010
Visitng Scholar
Svtc Jan 2008 - Nov 2008
Integration and Device Engineer, Customer Proejct Manager
Education:
The University of Texas at Austin 2004 - 2008
Doctorates, Doctor of Philosophy, Electrical Engineering, Philosophy
The University of Texas at Austin 1994 - 1996
Masters, Electronics Engineering
Bangladesh University of Engineering and Technology 1988 - 1993
Bachelors, Bachelor of Science In Electrical Engineering, Electronics Engineering
Skills:
Metrology Integration Semiconductor Industry Semiconductors Characterization Cmos Thin Films Mems Nanotechnology Simulations Ic Design of Experiments Jmp Process Integration Materials Science Failure Analysis Silicon Device Characterization Spc Physics Semiconductor Device R&D
PDF Solutions San Jose, CA Jan 2013 to Oct 2013 Advanced Technology Design of Experiments EngineerAixtron Inc Sunnyvale, CA Apr 2010 to Dec 2012 Sr. Process EngineerCenter for Integrated Systems Stanford, CA Sep 2009 to Apr 2010 Visiting scholarSVTC Austin, TX Jan 2008 to Dec 2008 project manager and integration expert for the International SEMATECHTechnology Engineering Group, ATDF, International SEMATECH Austin, TX Mar 2001 to Dec 2007 Technology Product EngineerUniversity of Texas Austin, TX Jan 1997 to Aug 2000 Course work and later research assistantMotorola Austin, TX Jun 1996 to Oct 1998 SRAM technology Development
Education:
The University of Texas at Austin Austin, TX Dec 2008 PhD in Electronics Electrical EngineeringThe University of Texas at Austin Austin, TX Aug 1996 MS in Electrical Engineering
Us Patents
Systems And Methods For Fabricating Vertical Bipolar Devices
Systems and methods for fabricating bipolar and/or biCMOS devices are described. A combination of bipolar fabrication steps and CMOS, and in particular, SOI fabrication steps may be used. In one embodiment, a collector region and/or a base region of a bipolar device may be formed using a bipolar mask, and an emitter region may be defined by a CMOS mask.
Three-Dimensional Single Transistor Semiconductor Memory Device And Methods For Making Same
Single-transistor memory cell including a three-dimensional capacitor and methods for fabricating the cell are disclosed. The method includes steps for defining a source and drain, forming a channel between the source and drain, and forming a gate area of a transistor. The method also includes forming a first and second capacitor plate of a three-dimensional capacitor coupled to the drain of the transistor. In one respect, the first capacitor plate may be formed substantially simultaneously with the step of forming the channel. Additionally, the second capacitor plate may be formed substantially simultaneously with the step of defining the gate area of the transistor. The capacitor may include a three-dimensional fin capacitor and the transistor may include, for example, a multi-gate field effect transistor, a fin field effect transistor, a tri-gate transistor, a Π transistor, and a Ω transistor.
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