Ross Popescu - Morgan Hill CA, US Clarence Tamargo - Stockton CA, US Shan Jiang - Morgan Hill CA, US
Assignee:
Towa Corporation
International Classification:
H01L 21/304
US Classification:
451 6, 451 60, 438460
Abstract:
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.
Ross Popescu - Morgan Hill CA, US Clarence Tamargo - Stockton CA, US Shan Jiang - Morgan Hill CA, US
Assignee:
Towa Intercon Technology, Inc. - Morgan Hill CA
International Classification:
C30B001/00 B24B005/00 B24B029/00
US Classification:
117200000
Abstract:
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.
Ross Popescu - Morgan Hill CA, US Shan Jiang - Morgan Hill CA, US
International Classification:
B23K 15/00
US Classification:
219121180
Abstract:
A single multidirectional chuck for use with a cutting beam such as a fluid jet is disclosed. The single multidirectional chuck includes a first set of cutting slots oriented in a first direction and a second set of cutting slots oriented in a second direction that is transverse to the first direction. One set of cutting slots extends entirely through the chuck so that the cutting beam may pass therethrough. The other set of cutting slots, which are transverse to the first set, only extend partially into the chuck. The partially extended cutting slots each provide a space that leads to a sacrificial member housed with a cavity in the single chuck. During a cutting operation, the cutting beam passes through the partially extended cutting slots and bombards the sacrificial member. The sacrificial member is configured to sacrifice itself in order to protect the structural components of the chuck. The sacrificial member is also configured to temper and redirect the flow of the fluid jet so that it can be exhausted out of the chuck as for example through the fully extended cutting slots.
Wearable Device Assembly Inspection Devices And Methods
Ross Popescu - San Francisco CA, US Richard Zhu - San Francisco CA, US
Assignee:
AliphCom - San Francisco CA
International Classification:
G06T 7/00 G06T 7/40 G06F 1/16
Abstract:
Automated optical inspection of a wearable device and/or sub-assemblies of the wearable device in-situ in an ambient environment where temperature and ambient lighting are need not be controlled are described. A key gold unit for the wearable device or a subassembly of the wearable device may be mounted to an automated optical inspections system that captures images of the key gold unit, converts the image from a color space it was captured in to a Hue, Saturation and Value/Brightness color space. Units under test are imaged while stationary or while being rotated (e.g., 360 degrees) and are imaged. Image data is converted into the Hue, Saturation and Value/Brightness color space and compared with the data from the key gold unit to determine if the unit under test is color matched with the key gold unit. Functionality such as near field communications, capacitive touch, display functionality and others may be tested.
Solaria Corporation since Feb 2011
Sr. Director, Process & Automation
Gemfire 2006 - 2011
Director Operations & Automations
Towa Intercon 1998 - 2006
Director Engineering and Technology
Topaz Technologies 1997 - 1998
Manager, Process Engineering
Disco Hi-Tec USA 1992 - 1997
Manager, PMP
Skills:
Engineering Continuous Improvement Automation Process Improvement Program Management Manufacturing Design of Experiments Product Management Cross Functional Team Leadership Supply Chain Management Strategic Planning Team Management Project Planning Operations Management Failure Analysis Leadership Automation Design Testing Fmea Business Strategy Troubleshooting Root Cause Analysis Quality Assurance Process Simulation Manufacturing Operations Pmp Semiconductor Industry Product Engineering Change Management Business Development Materials Iso Telecommunications Electrical Engineering Purchasing Mobile Device Management Business Planning Contract Manufacturing Value Stream Mapping Metrology Solar Pv Quality System Budgets Sales Management Kaizen Solar Energy Economics Dmaic Ethernet Transition Management