Roger R. Shiel - Vinton IA Brian K. Smith - Marion IA
Assignee:
Rockwell Collins - Cedar Rapids IA
International Classification:
H01L 2144 H01L 2148 H01L 2150
US Classification:
438106
Abstract:
A method of protecting an electronic component from damage, wherein the electronic component includes a semiconductor chip. According to the method, a first protective substance is applied to an outer surface of the semiconductor chip. The first protective substance has a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the semiconductor chip. A second substance may then applied to an outer surface of the first protective substance. The first protective substance is applied such that it protects the semiconductor chip from damage during the application of the second substance.
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Part 39 of. Super Mario 64 DS Walkthrough *WATCH IT IN HQ* all the 100...
Roger Shiel 1983 graduate of Brophy College Preparatory School in Phoenix, AZ is on Classmates.com. See pictures, plan your class reunion and get caught up with Roger and other ...