Rakesh Batish - Phoenixville PA, US Richard M. Pointer - Media PA, US
Assignee:
Antares Advanced Test Technologies, Inc. - Vancouver WA
International Classification:
H01R 12/00
US Classification:
439 66, 439 91
Abstract:
An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.
Northrop Grumman Corporation Oct 2018 - Jan 2019
Program Manager, New Product Development
Lockheed Martin Oct 2018 - Jan 2019
Chief Engineer
Northrop Grumman Corporation Jan 2017 - Sep 2018
Modeling and Simulation Ipt Lead, Advanced Hypersonics
Orbital Atk Jan 1, 2012 - Jul 2009
Chief Engineer, Sdacs Technology Development
Orbital Atk Jul 2009 - Jan 2012
Senior Manager, Systems Engineering
Education:
Drexel University 1990 - 1996
Doctorates, Doctor of Philosophy, Mechanical Engineering
University of Delaware 1982 - 1986
Bachelors, Bachelor of Science, Mechanical Engineering
Drexel University
Master of Science, Masters, Mechanical Engineering
Skills:
Finite Element Analysis Systems Engineering Engineering Management Aerospace Composites Mechanical Engineering Space Systems Aerospace Engineering Spacecraft Engineering Pro Engineer Lean Manufacturing Teamcenter Gd&T Design For Manufacturing Solid Modeling Design Engineering Data Acquisition Failure Analysis Root Cause Analysis Dod Cfd Simulations Propulsion U.s. Department of Defense Computer Aided Design