Richard D Kuder

US Patent:

61656135, Dec 26, 2000

Filed:

Mar 9, 1999

Appl. No.:

9/264999

Inventors:

Christine Puglisi - Mountainside NJ
Gregory Krieger - Somerville NJ
David Shenfield - Fountain Valley CA
Richard Kuder - Anaheim CA
Chaodong Xiao - East Hanover NJ

Assignee:

National Starch and Chemical Investment Holding Corporation - Wilmington DE

International Classification:

B32B 1504
B32B 712
C08K 310

US Classification:

428355R

Abstract:

This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.