Richard M Biron

US Patent:

6603079, Aug 5, 2003

Filed:

Feb 5, 1999

Appl. No.:

09/244801

Inventors:

Richard M. Biron - Melbourne FL

Assignee:

Mack Technologies Florida, Inc. - West Melbourne FL

International Classification:

H05K 100

US Classification:

174254, 174261, 174262

Abstract:

A device used in the formation of interconnected printed circuit boards and the like, the device comprising a rigid dielectric layer; a window in the dielectric layer; and at least two interconnects. Each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window. A portion of the each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window. The interconnects do not cover the entire window.

US Patent:

6691408, Feb 17, 2004

Filed:

Oct 10, 2001

Appl. No.:

09/975279

Inventors:

Richard M. Biron - Melbourne FL

Assignee:

Mack Technologies Florida, Inc. - West Melbourne FL

International Classification:

H01K 300

US Classification:

29852, 29825, 29846

Abstract:

A method for forming electrical interconnects for printed circuit boards and the like includes the steps of laminating a first surface of a rigid dielectric substrate with a first conductive laminate such that the first conductive laminate extends beyond at least one edge of the dielectric substrate, patterning the first conductive laminate to define a plurality of electrical interconnects which extend beyond the edge(s) of the dielectric substrate, forming a plurality of conductive traces on a second surface of the dielectric substrate and forming a plurality of openings in the dielectric substrate, each opening extending from a first location on the first surface of the dielectric which is proximate at least one electrical interconnect to a second location on the second surface of the substrate which is proximate at least one conductive trace. Conductive material is formed within the openings of the dielectric substrate such that the conductive material facilitates electrical communication between the electrical interconnects and the conductive traces. The electrical interconnects may be formed so as to either provide electrical communication between a plurality of printed circuit boards or so as to define terminations for such printed circuit boards.

US Patent:

53068742, Apr 26, 1994

Filed:

Jul 12, 1991

Appl. No.:

7/728978

Inventors:

Richard M. Biron - Melbourne FL

Assignee:

W.I.T. Inc. - Melbourne FL

International Classification:

H05K 0100

US Classification:

174262

Abstract:

In order to form a (flexible) electrical interconnect structure a flexible dielectric substrate having a plurality of windows is laminated between a first, relatively thin flexible conductor layer and a second, relatively thick conductor layer. The first flexible conductor layer is patterned into a plurality of flexible conductor lines The second conductor layer is patterned into first and second pluralities of spaced apart terminals, which overlie the windows. Conductive vias are formed through the flexible dielectric substrate between the terminals and the flexible conductor lines, thereby connecting the terminals on one side of the flexible substrate to the flexible conductor lines on the other side of the substrate.