Ray H Purdom

US Patent:

8530981, Sep 10, 2013

Filed:

Dec 16, 2010

Appl. No.:

12/969821

Inventors:

James Richard Huckabee - Sherman TX, US
Ray H. Purdom - Sherman TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 29/66
H01L 21/02

US Classification:

257414, 438 48

Abstract:

A low-cost microelectromechanical system (MEMS) device has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier stepped recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc. , is assembled on the inset so that the chip opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel extends from the ambient exterior through the vent and the second perforation to the second tier recess, which acts as a channel and connects to the first perforation and the chip opening to the membrane.

US Patent:

20140011313, Jan 9, 2014

Filed:

Sep 10, 2013

Appl. No.:

14/022333

Inventors:

Ray H. Purdom - Sherman TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

B81C 1/00

US Classification:

438 51

Abstract:

A low-cost microelectromechanical system (MEMS) device has a mass-produced carrier fabricated as a pre-molded leadframe so that the space of the leadframe center is filled with compound and a two-tier stepped recess is created in the center. The first tier is filled by an inset with a first perforation and a second perforation. An integrated circuit chip with an opening and a membrane at the end of the opening, operable as a pressure sensor, microphone, speaker, etc, is assembled on the inset so that the chip opening is aligned with the first perforation. The chip is protected by a cover transected by a vent aligned with the second inset perforation. An air channel extends from the ambient exterior through the vent and the second perforation to the second tier recess, which acts as a channel and connects to the first perforation and the chip opening to the membrane.

US Patent:

56644973, Sep 9, 1997

Filed:

Dec 20, 1995

Appl. No.:

8/575232

Inventors:

Edgar R. Zuniga - Sherman TX
Archie W. Sutton - Howe TX
Ray H. Purdom - Sherman TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B41F 2304

US Classification:

101487

Abstract:

The invention is to a method of placing symbolization on a heat spreader, used in conjunction with the semiconductor package, through the use of a low powered laser beam. The beam is scanned over the package surface at a preset intensity and for a desired time to change the surface texture of the heat spreader, and to change the reflectivity of the scanned area.