Nickolas D Kingsley from Bedford, NH, age 44

Us Patents

Multilayer Electronic Component Systems And Methods Of Manufacture
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US Patent:

20100090902, Apr 15, 2010
Filed:

Nov 23, 2005
Appl. No.:

11/993890
Inventors:

Dane Thompson - Atlanta GA, US
Guoan Wang - Atlanta GA, US
Nickolas D. Kingsley - Atlanta GA, US
Emmanouil M. Tentzeris - Atlanta GA, US
Gerald DeJean - Atlanta GA, US
RongLin Li - Atlanta GA, US
International Classification:

H01Q 1/38
H01Q 5/00
US Classification:

343700MS
Abstract:

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (Lcp) And Methods Of Manufacture
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US Patent:

20100201003, Aug 12, 2010
Filed:

Nov 23, 2005
Appl. No.:

11/817563
Inventors:

Dane Thompson - Atlanta GA, US
Guoan Wang - Atlanta GA, US
Nickolas D. Kingsley - Atlanta GA, US
Ioannis Papapolymerou - Decatur GA, US
Emmanouil M. Tentzeris - Atlanta GA, US
International Classification:

H01L 23/28
H01L 21/56
US Classification:

257788, 438127, 257E23116, 257E21502
Abstract:

Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component.

Adaptive Receiver/Transmitter Amplifier Circuit
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US Patent:

20150180426, Jun 25, 2015
Filed:

Nov 17, 2014
Appl. No.:

14/543767
Inventors:

- Chelmsford MA, US
Nickolas D. Kingsley - Andover MA, US
International Classification:

H03F 1/30
H03F 3/21
H03F 1/56
H03F 3/193
Abstract:

A SMART amplifier circuit is disclosed. The amplifier circuit comprises a processor configured to receive a state control signal and generate a plurality of control signals, a power amplifier configured to provide an amplified RF signal that is a function of the RF input signal and the first control signal, and a tunable matching network configured to receive a second control signal and to provide a tuned, amplified RF output signal as an output that is a function of the amplified RF signal and the second control.

Dual Path Rf Amplifier Circuit
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US Patent:

20150137885, May 21, 2015
Filed:

Nov 17, 2014
Appl. No.:

14/543371
Inventors:

- Chelmsford MA, US
Nickolas D. Kingsley - Andover MA, US
International Classification:

H03F 1/02
H03F 3/21
H03F 3/19
US Classification:

330124 R
Abstract:

A dual path RF amplifier circuit including two or more amplifiers that are configurable as to any combination of class of operation, biasing, and power ratio to achieve a desired power curve for the amplifier circuit. In one example, an RF amplifier circuit includes an input coupler that generates at least two coupled signals from an RF input signal, first and second RF amplifiers each configured to receive and amplify one of the coupled signals to generate first and second amplified signals, and an output coupler generate an amplified output signal based on the first and second amplified signals. The first RF amplifier is biased into a first class of operation, and the second RF amplifier is biased into a second class of operation, wherein a power ratio between the first and second RF amplifiers is selected based on the amplifier biasing and the first and second classes of operation.

Resumes

Director Of Engineering At Auriga Microwave

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Position:

Director of Engineering at Auriga Microwave

Location:

Greater Boston Area

Industry:

Defense & Space

Work:

Auriga Microwave - Chelmsford, MA USA since Jun 2007
Director of Engineering
IEEE International Microwave Symposium (IMS) 2007 - 2011
Technical Program Review Committee (TPRC)
2009 IEEE International Microwave Symposium Jan 2008 - Jun 2009
Steering Committee Member
Georgia Institute of Technology Jun 2002 - May 2007
Graduate Research Assistant
Compaq Computer Corporation 1999 - 2003
Coop student

Education:

Georgia Institute of Technology 1998 - 2007
PhD, Electrical Engineering

Interests:

Passive and active circuit design, emerging technology, marathon running, travel, and martial arts (Tae Kwon Do)

Honor & Awards:

2011, 2010 International Microwave Symposium Chairman of Technical Program Review Committee for Passive Circuits 2006 GA Tech Packaging Research Center Industry Advisory Board Poster Competition Winner (1st place in September, 2nd place in March) 2006 GA Tech Graduate Research Symposium Award Winner (2nd place) for the College of Engineering 2006 School of ECE Student Project Expo Award Winner (2nd place) Trainer of the Year by GA Tech Microelectronics Research Center (1st place in 2006, 2nd place in 2005) 2002 GA Tech President’s Undergraduate Research Award Recipient 2001 Compaq Armada Award Recipient (Outstanding coop student of the year) 2003-2004 President of GA Tech Tae Kwon Do Club (2nd degree brown belt) 1998-2002 PepsiCo Scholarship Award Recipient (Outstanding student award)