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Nicholas E Aneshansley

age ~78

from Poway, CA

Also known as:
  • Nicholas Edward Aneshansley
  • Nick E Aneshansley
  • Nicolas E Aneshansley
  • Ni Aneshansley
  • Aneshansley Ni
Phone and address:
12725 Soule St, Poway, CA 92064
8588424187

Nicholas Aneshansley Phones & Addresses

  • 12725 Soule St, Poway, CA 92064 • 8588424187
  • 11382 Penanova St, San Diego, CA 92129 • 8586723798
  • Dayton, OH

Us Patents

  • Victim Invalidation

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  • US Patent:
    6961827, Nov 1, 2005
  • Filed:
    Nov 13, 2001
  • Appl. No.:
    10/011115
  • Inventors:
    Patricia Shanahan - San Diego CA, US
    Andrew E. Phelps - Encinitas CA, US
    Nicholas E. Aneshansley - San Diego CA, US
  • Assignee:
    Sun Microsystems, Inc. - Santa Clara CA
  • International Classification:
    G06F012/00
  • US Classification:
    711144, 711133, 711134, 711135, 711145
  • Abstract:
    The present invention provides a method and apparatus for invalidating a victimized entry. The apparatus comprises a directory cache adapted to store one or more cache entries, and a control unit. The control unit is adapted to determine whether it is desirable to remove a shared cache entry from the directory cache, and invalidate the shared cache entry in response to determining that it is desirable to remove the shared cache entry from the directory cache.
  • Thermal Transfer Technique Using Heat Pipes With Integral Rack Rails

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  • US Patent:
    7626820, Dec 1, 2009
  • Filed:
    May 15, 2008
  • Appl. No.:
    12/121303
  • Inventors:
    Michael V. Konshak - Louisville CO, US
    Guoping Xu - San Diego CA, US
    Nicholas E. Aneshansley - San Diego CA, US
  • Assignee:
    Sun Microsystems, Inc. - Santa Clara CA
  • International Classification:
    H05K 7/20
    F28F 1/00
  • US Classification:
    361700, 165 804, 16510433, 361699, 361701, 361702
  • Abstract:
    A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.
  • Multiprocessor Computer Having Configurable Hardware System Domains

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  • US Patent:
    RE41293, Apr 27, 2010
  • Filed:
    Aug 1, 2001
  • Appl. No.:
    09/920433
  • Inventors:
    Daniel P. Drogichen - Encinitas CA, US
    Andrew J. McCrocklin - San Diego CA, US
    Nicholas E. Aneshansley - San Diego CA, US
  • Assignee:
    Sun Microsystems, Inc. - Santa Clara CA
  • International Classification:
    G06F 15/173
    G06F 11/00
    G06F 15/76
  • US Classification:
    712 15, 712 23, 712 29, 709242
  • Abstract:
    Global address and data routers interconnect individual system units each having its own processors, memory, and I/O. A domain filter coupled to the routers dynamically defines groups of system units as domains and clusters of domains which have both software and hardware isolation from each other. Clusters can share dynamically definable ranges of memory with each other. The domain filter has software-loadable registers on the system units and in the global routers to set the parameters of the domains and clusters. The registers label individual inter-system transactions on the routers as invalid for system units not in the same domain or cluster as the originating unit.
  • Dynamically Configuring Processor Resources

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  • US Patent:
    20030097508, May 22, 2003
  • Filed:
    Nov 16, 2001
  • Appl. No.:
    09/992439
  • Inventors:
    Nicholas Aneshansley - San Diego CA, US
  • International Classification:
    G06F009/00
    G06F013/00
  • US Classification:
    710/302000
  • Abstract:
    The present invention provides a method and apparatus for dynamically configuring processor resources. The method includes processing tasks associated with at least one processor, wherein the processor comprises at least one cache memory having data stored therein. The method further includes transferring at least a portion of the data of the cache memory to another location and removing the processor from a system in response to transferring at least the portion of the data from the cache memory to another location, while the system is in operation.
  • Method And Apparatus For Providing Simplified Booting Of Domains In A Multi-Domain Computer System

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  • US Patent:
    20030097556, May 22, 2003
  • Filed:
    Nov 16, 2001
  • Appl. No.:
    09/992446
  • Inventors:
    Gary Gilbert - San Diego CA, US
    Nicholas Aneshansley - San Diego CA, US
    Richard Rogers - San Diego CA, US
    Veronica Gauss - Watertown MA, US
  • International Classification:
    G06F015/177
  • US Classification:
    713/002000
  • Abstract:
    A method and apparatus for booting a domain in a computer system configurable with a plurality of domains. The method includes locating one or more available boot locations on one or more local storage drives and identifying a boot location on a local storage drive. The method also includes booting the domain from the boot location on the local storage drive. The device includes a first connector and a bus bridge coupled to the first connector. A storage controller is coupled to the bus bridge. A storage device is coupled to the controller. The storage device is configured to boot a domain.
  • Techniques For Cooling Electronic Equipment

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  • US Patent:
    20070019391, Jan 25, 2007
  • Filed:
    Jul 20, 2005
  • Appl. No.:
    11/185531
  • Inventors:
    Guoping Xu - San Diego CA, US
    Gary Gilbert - San Diego CA, US
    Nicholas Aneshansley - San Diego CA, US
  • Assignee:
    Sun Microsystems, Inc. - Santa Clara CA
  • International Classification:
    H05K 5/00
  • US Classification:
    361752000
  • Abstract:
    Electronic equipment housed in a cabinet is cooled using air that flows from one of a right side and a left side of the electronic equipment to the other one of the right side and the left side of the electronic equipment. The air is cooled using a heat exchanger that uses water or a refrigerant supplied to the cabinet. One or more components of the electronic equipment may be accessed via a front or back door of the cabinet without disrupting the cooling air flow in other components of the electronic equipment.
  • Method And System For Cooling Electronic Equipment

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  • US Patent:
    20070283710, Dec 13, 2007
  • Filed:
    Jun 12, 2006
  • Appl. No.:
    11/451281
  • Inventors:
    Gary L. Gilbert - San Diego CA, US
    Nicholas E. Aneshansley - San Diego CA, US
    Guoping Xu - San Diego CA, US
  • Assignee:
    Sun Microsystems, Inc. - Santa Clara CA
  • International Classification:
    F25D 23/12
    F25D 17/04
  • US Classification:
    622592, 62407
  • Abstract:
    A system includes electronic equipment, a device arranged to cool air using a refrigerant, the device secured to one of a top side and a bottom side of the electronic equipment, and a housing arranged to enclose the electronic equipment and the device, where the cooled air is propagated from one of the top side and the bottom side of the electronic equipment to the other one of the top side and the bottom side of the electronic equipment.
  • Mechanism For Cooling Electronic Components

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  • US Patent:
    20080013283, Jan 17, 2008
  • Filed:
    Jul 17, 2006
  • Appl. No.:
    11/488281
  • Inventors:
    Gary L. Gilbert - San Diego CA, US
    Guoping Xu - San Diego CA, US
    Nicholas E. Aneshansley - San Diego CA, US
    Edward Lee Follmer - Del Mar CA, US
  • International Classification:
    H05K 7/20
  • US Classification:
    361715
  • Abstract:
    A mechanism is disclosed for cooling electronic components of a module housed in a chassis. The chassis may be, for example, a rack or other housing, which may contain many such modules. The system comprises an external cooling system, and an internal cooling system for cooling electronic components on the module. The internal cooling system may reside on the module. The internal cooling system can be removed from the chassis to enable servicing components on the module without disconnecting any lines carrying cooling fluid in either fluid cooling system.

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