Moulik A Shah

age ~39

from Chicago, IL

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Also known as:

Moulik A Shsh
Shah Moulik

Connected to:

Moulik Shah Phones & Addresses

Chicago, IL
362 Prairie Meadow Ln, Vernon Hills, IL 60061
Arlington Heights, IL
Orland Park, IL
Coralville, IA
Cedar Rapids, IA
Champaign, IL
Palatine, IL

Work

Company:

Panduit corporation
Jun 2011
Position:

Senior product engineer

Education

School / High School:

UNIVERSITY OF ILLINOIS- Chicago, IL
May 2014
Specialities:

Masters of Science in Electrical Engineering

Skills

Project management • Design • R&D • Legal Research • Sr. Engineer • 3D Modelling • HFSS • Microsoft Project • LabView • DOORS • History of Design • Q3D • SPICE • Schematic Capture • Lean • Electrical engineering • Product development • Patent filed • RF

Us Patents

Communication Connectors Having Crosstalk Compensation Networks
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US Patent:

20140273638, Sep 18, 2014
Filed:

Mar 17, 2014
Appl. No.:

14/215817
Inventors:

- Tinley Park IL, US
Moulik Shah - Chicago IL, US
Ronald L. Tellas - Schererville IN, US
Robert E. Fransen - Tinley Park IL, US
Satish I. Patel - Roselle IL, US
Tse-Yu Lin - Cupertino CA, US
Assignee:

PANDUIT CORP. - Tinley Park IL
International Classification:

H01R 13/6466
US Classification:

43962022
Abstract:

The present invention generally relates to the field of network communications, and more specifically to networks for crosstalk reduction/compensation and communication connectors which employ such networks. In an embodiment, the present invention is an RJ45 jack with an orthogonal. compensation network to meet CAT6A or higher performance standard. For the 3:6-4:5 wire-pair combination, the orthogonal compensation network begins in the jack nose (plug interface contact (PIC)) section, and utilizes a flexible printed circuit board in the nose section, split PIC contacts in the rear nose, and circuitry in the rigid printed circuit board to create the orthogonal compensation network.

Front Sled Assemblies For Communication Jacks And Communication Jacks Having Front Sled Assemblies
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US Patent:

20140256185, Sep 11, 2014
Filed:

Mar 10, 2014
Appl. No.:

14/203057
Inventors:

- Tinley Park IL, US
Satish I. Patel - Roselle IL, US
Joshua A. Valenti - Wheeling IL, US
Tse-Yu Lin - Cupertino CA, US
Moulik Shah - Orland Park IL, US
Assignee:

Panduit Corp. - Tinley Park IL
International Classification:

H01R 13/17
US Classification:

439626
Abstract:

The present invention generally relates to communication connectors and internal components thereof. In one embodiment, the present invention is a communication jack comprising both front-rotated and back rotated plug interface contacts. In another embodiment, the present invention is a communication jack comprising a two-piece front sled. In yet another embodiment, the present invention is a communication jack that retains its functionality when mated with both eight-position and six-position plugs.

Resumes

Senior Strategy And Execution Program Manager

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Location:

362 Prairie Meadow Ln, Vernon Hills, IL 60061

Industry:

Medical Devices

Work:

Baxter International Inc.
Senior Strategy and Execution Program Manager
G&W Electric Co. Jun 2014 - Sep 2015
Electrical Project Engineer, R and D
Panduit Jun 2011 - Jun 2014
Senior Product Design Engineer
Rockwell Collins Jan 2007 - Jun 2011
Hardware Design Engineering
Rockwell Collins May 2008 - Aug 2008
Hardware Coop

Education:

University of Illinois at Chicago 2011 - 2014
Master of Science, Masters, Electronics Engineering University of Illinois at Chicago 2008
Bachelors, Bachelor of Science, Electronics Engineering Hvs High School
Iowa State University
University of Illinois at Urbana - Champaign

Skills:

Rf
Simulations
Ansoft Hfss
Ansoft Q3D
Ltspice
Project Management
Microsoft Office
Mentor Graphics Pads
Failure Analysis
Pcb Design
Design For Manufacturing
Electrical Engineering
Engineering
Testing
Matlab
Design Engineering
Systems Engineering
Doors
Ethernet
Do 254
Multifunctional
Product Development
Lean Tools
Lean Thinking
Vendor Management
Engineering Management
Embedded Software
Embedded Systems
Manufacturing
Cross Functional Team Leadership
Electronics
R&D
Process Improvement
Root Cause Analysis
Fmea
Product Design
Hardware
Program Management
Strategic Planning
Budget Management
Resource Management
Stakeholder Management
Cost Reduction
Portfolio Management
Design Control

Interests:

Technology
Sports
Investing and Outdoor Activities
Travel

Languages:

Telugu
Hindi
Gujarati
English

Moulik Shah

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Moulik Shah Chicago, IL

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Work:

PANDUIT CORPORATION

Jun 2011 to 2000
Senior Product Engineer ROCKWELL COLLINS
Cedar Rapids, IA
Jan 2009 to Jun 2011
Hardware Design Engineer ROCKWELL COLLINS
Cedar Rapids, IA
May 2008 to Aug 2008
Hardware Design Engineering Co-Op Rockwell Collins
Cedar Rapids, IA
Jan 2007 to Aug 2007
Hardware Design Engineering Co-Op GE CONSUMER & INDUSTRIAL
Louisville, KY
Jan 2006 to Aug 2006
Dish Washer Electronics Team

Education:

UNIVERSITY OF ILLINOIS
Chicago, IL
May 2014
Masters of Science in Electrical Engineering UNIVERSITY OF ILLINOIS
Chicago, IL
Bachelor of Science in Electrical Engineering

Skills:

Project management, Design, R&D, Legal Research, Sr. Engineer, 3D Modelling, HFSS, Microsoft Project, LabView, DOORS, History of Design, Q3D, SPICE, Schematic Capture, Lean, Electrical engineering, Product development, Patent filed, RF