Shafi Saiyed from 15 Heritage Dr, Salem, MA 01970, age 49, Phone: 9787445496

Shafi Saiyed Phones & Addresses

15 Heritage Dr, Salem, MA 01970 • 9787445496
Lynnfield, MA
North Attleboro, MA
26 Kenmar Dr, Billerica, MA 01821 • 9786674321
Waltham, MA
Johnson City, NY
Binghamton, NY

Work

Company:

Analog devices
May 2011
Position:

Mems package development

Education

Degree:

PhD
School / High School:

State University of New York at Binghamton
1999 to 2004
Specialities:

Systems Science (Manufacturing Systems, Electronics Packaging/Manufacturing)

Skills

Semiconductors • Failure Analysis • Design of Experiments • Simulations • Engineering Management • SPC • IC • Product Development • Manufacturing • FMEA • Characterization • Cross-functional Team Leadership • MEMS • Electronics Packaging • Digital Signal Processors • SMT

Industries

Semiconductors

Resumes

Mems Package Development At Analog Devices

view source

Position:

MEMS Package Development at Analog Devices

Location:

Greater Boston Area

Industry:

Semiconductors

Work:

Analog Devices since May 2011
MEMS Package Development
MediaTek Jan 2008 - Feb 2011
Sr. Package Development Engineer
Analog Devices Dec 2003 - Dec 2007
Sr. Package Development Engineer
Universal Instruments Sep 2001 - Nov 2003
Graduate Research Associate
Larsen & Toubro Limited Jul 1997 - Aug 1999
Engineer

Education:

State University of New York at Binghamton 1999 - 2004
PhD, Systems Science (Manufacturing Systems, Electronics Packaging/Manufacturing) The Maharaja Sayajirao University of Baroda 1993 - 1997
BE, Mechanical

Skills:

Semiconductors
Failure Analysis
Design of Experiments
Simulations
Engineering Management
SPC
IC
Product Development
Manufacturing
FMEA
Characterization
Cross-functional Team Leadership
MEMS
Electronics Packaging
Digital Signal Processors
SMT

Us Patents

Systems And Methods For Air-Release In Cavity Packages
view source
US Patent:

20130093031, Apr 18, 2013
Filed:

Oct 4, 2012
Appl. No.:

13/645094
Inventors:

Analog Devices, Inc. - Norwood MA, US
Jicheng Yang - North Andover MA, US
Shafi Saiyed - Lynnfield MA, US
Siu Lung Ng - Stoneham MA, US
Xiaojie Xue - Woburn MA, US
Assignee:

ANALOG DEVICES, INC. - Norwood MA
International Classification:

H01L 29/84
H01L 29/66
US Classification:

257417, 438 51
Abstract:

A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Low Stress Integrated Device Package
view source
US Patent:

20220177298, Jun 9, 2022
Filed:

Dec 4, 2020
Appl. No.:

17/112894
Inventors:

- Norwood MA, US
Shafi Saiyed - Lynnfield MA, US
Thomas M. Goida - Windham NH, US
International Classification:

B81B 7/00
B81C 1/00
Abstract:

An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

Packages For Stress-Sensitive Device Dies
view source
US Patent:

20160090298, Mar 31, 2016
Filed:

Nov 26, 2014
Appl. No.:

14/554661
Inventors:

- Norwood MA, US
Shafi Saiyed - Lynnfield MA, US
International Classification:

B81B 7/00
B81C 1/00
Abstract:

An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.