A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.
James C Baar - Logansport IN, US Michael W Blazier - Kokomo IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01L021/48
US Classification:
438115, 438118
Abstract:
Integrated circuit moisture resistant apparatuses () are provided for preventing moisture absorption by an integrated circuit (). The moisture resistant apparatuses include at least one integrated circuit housing () that has a plurality of inner walls (), which form at least one inner cavity (). A desiccant body () is coupled to at least a portion of the plurality of inner walls () and absorbs moisture within the inner cavity (). A method for performing the same is provided. Also, a manufacturing method of preventing moisture absorption by the integrated circuit () is provided.
Method Of Forming Assemblies Of Circuit Boards In Different Planes
Michael Wayne Blazier - Kokomo IN Frank Martin Stephan - Galveston IN
Assignee:
Delco Electronics Corporaiton - Kokomo IN
International Classification:
H05K7/02
US Classification:
361749
Abstract:
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.