Merton Darrell Briggs

US Patent:

60022663, Dec 14, 1999

Filed:

May 23, 1995

Appl. No.:

8/448290

Inventors:

Merton Darrell Briggs - Chelmsford MA
Alfred H. Miller - Sudbury MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

G01R 3102
G01R 3126

US Classification:

324758

Abstract:

A singulated die test socket is presented. The socket allows for die to be fully functional tested and thermal tested before packaging. The socket is created from similar silicon material as the die being tested thereby producing a match of thermal coefficients of expansion between the socket and the die. It is also possible to provide additional circuitry in the socket to aid in the testing of the die. The test socket may also be used as an integrated circuit package by adding a lid, used to seal the die within the package cavity. In both uses the socket cavity may be created with sloping sidewalls, the sloping sidewalls providing for self alignment of the die within socket cavity.