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Marion A Tibesar

age ~68

from Rochester, MN

Marion Tibesar Phones & Addresses

  • 1515 Graham Ct, Rochester, MN 55904 • 5072921480
  • 3076 25Th St, Rochester, MN 55901 • 5072921480
  • 207 Poplar St, Northfield, MN 55057 • 5076456590
  • 1515 Graham Ct SE, Rochester, MN 55904 • 5072503194

Work

  • Company:
    Mayo clinic
  • Position:
    Laboratory assistant

Industries

Hospital & Health Care

Us Patents

  • Printed Wiring Board With Photoimageable Dielectric Base Substrate And Method Of Manufacture Therefor

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  • US Patent:
    57099790, Jan 20, 1998
  • Filed:
    Oct 21, 1994
  • Appl. No.:
    8/327236
  • Inventors:
    Keith L. Casson - Northfield MN
    Matthew John Saari - Northfield MN
    Raphael A. Marsolek - Northfield MN
    Marion Tibesar - Northfield MN
  • Assignee:
    Sheldahl, Inc. - Northfield MN
  • International Classification:
    G03F 700
  • US Classification:
    430311
  • Abstract:
    A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.
  • Method Of Manufacturing A Multilayer Electronic Circuit

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  • US Patent:
    57273103, Mar 17, 1998
  • Filed:
    Jun 11, 1996
  • Appl. No.:
    8/661809
  • Inventors:
    Keith L. Casson - Northfield MN
    Carol Myers - Faribault MN
    Kenneth B. Gilleo - W. Kingston RI
    Deanna Suilmann - Bloomer WI
    Edward Mahagnoul - Faribault MN
    Marion Tibesar - Northfield MN
  • Assignee:
    Sheldahl, Inc. - Northfield MN
  • International Classification:
    H05K 336
  • US Classification:
    29830
  • Abstract:
    A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
  • Method And Apparatus For Preparing Conductive Screened Through Holes Employing Metallic Plated Polymer Thick Films

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  • US Patent:
    47472111, May 31, 1988
  • Filed:
    Jun 5, 1987
  • Appl. No.:
    7/058520
  • Inventors:
    Kenneth B. Gilleo - Northfield MN
    Stephen E. Chabot - Apple Valley MN
    Marion A. Tibesar - Northfield MN
  • Assignee:
    Sheldahl, Inc. - Northfield MN
  • International Classification:
    H04K 310
  • US Classification:
    29852
  • Abstract:
    An apparatus and method for preparing conductive bridges to electrically couple discrete electrical conductors arranged on opposed surfaces of a common substrate. The method and apparatus utilized includes subjecting the bore or opening in the substrate to the force of vacuum applied through a vacuum diffusion barrier. The substrate is exposed to the vacuum source through a plurality of spaced-apart bores of relatively small diameter, with the vacuum diffusion layer being in the form of a web of filter paper tracking and moving in synchronism with the substrate. Conventional silk screening techniques are utilized to form the conductors and bridges, with polymer thick conductive fluids being employed as the printing medium. Multiple layers of conductors may be formed, with dual-sided circuitry being applied to the substrate. The multiple layers are fabricated by initially plating a layer of metal upon the exposed surface of the polymer thick conductive films, and thereafter printing a defined pattern of dielectric upon the electroplated copper.
  • Method For Electrically And Mechanically Connecting At Least Two Conductive Layers

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  • US Patent:
    55028896, Apr 2, 1996
  • Filed:
    Jan 8, 1993
  • Appl. No.:
    8/001811
  • Inventors:
    Keith L. Casson - Northfield MN
    Carol Myers - Faribault MN
    Kenneth B. Gilleo - W. Kingston RI
    Deanna Suilmann - Bloomer WI
    Edward Mahagnoul - Faribault MN
    Marion Tibesar - Northfield MN
  • Assignee:
    Sheldahl, Inc. - Northfield MN
  • International Classification:
    H05K 336
  • US Classification:
    29830
  • Abstract:
    A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
  • Multilayer Electronic Circuit Having A Conductive Adhesive

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  • US Patent:
    56885849, Nov 18, 1997
  • Filed:
    Sep 27, 1995
  • Appl. No.:
    8/534630
  • Inventors:
    Keith L. Casson - Northfield MN
    Carol Myers - Faribault MN
    Kenneth B. Gilleo - W. Kingston RI
    Deanna Suilmann - Bloomer WI
    Edward Mahagnoul - Faribault MN
    Marion Tibesar - Northfield MN
  • Assignee:
    Sheldahl, Inc. - Northfield MN
  • International Classification:
    B32B 900
  • US Classification:
    428209
  • Abstract:
    A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Resumes

Marion Tibesar Photo 1

Laboratory Assistant

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Location:
Rochester, MN
Industry:
Hospital & Health Care
Work:
Mayo Clinic
Laboratory Assistant

Mylife

Marion Tibesar Photo 2

Marcia Tibesar Coralvill...

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