Marion A Tibesar

US Patent:

57099790, Jan 20, 1998

Filed:

Oct 21, 1994

Appl. No.:

8/327236

Inventors:

Keith L. Casson - Northfield MN
Matthew John Saari - Northfield MN
Raphael A. Marsolek - Northfield MN
Marion Tibesar - Northfield MN

Assignee:

Sheldahl, Inc. - Northfield MN

International Classification:

G03F 700

US Classification:

430311

Abstract:

A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.

US Patent:

57273103, Mar 17, 1998

Filed:

Jun 11, 1996

Appl. No.:

8/661809

Inventors:

Keith L. Casson - Northfield MN
Carol Myers - Faribault MN
Kenneth B. Gilleo - W. Kingston RI
Deanna Suilmann - Bloomer WI
Edward Mahagnoul - Faribault MN
Marion Tibesar - Northfield MN

Assignee:

Sheldahl, Inc. - Northfield MN

International Classification:

H05K 336

US Classification:

29830

Abstract:

A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

US Patent:

47472111, May 31, 1988

Filed:

Jun 5, 1987

Appl. No.:

7/058520

Inventors:

Kenneth B. Gilleo - Northfield MN
Stephen E. Chabot - Apple Valley MN
Marion A. Tibesar - Northfield MN

Assignee:

Sheldahl, Inc. - Northfield MN

International Classification:

H04K 310

US Classification:

29852

Abstract:

An apparatus and method for preparing conductive bridges to electrically couple discrete electrical conductors arranged on opposed surfaces of a common substrate. The method and apparatus utilized includes subjecting the bore or opening in the substrate to the force of vacuum applied through a vacuum diffusion barrier. The substrate is exposed to the vacuum source through a plurality of spaced-apart bores of relatively small diameter, with the vacuum diffusion layer being in the form of a web of filter paper tracking and moving in synchronism with the substrate. Conventional silk screening techniques are utilized to form the conductors and bridges, with polymer thick conductive fluids being employed as the printing medium. Multiple layers of conductors may be formed, with dual-sided circuitry being applied to the substrate. The multiple layers are fabricated by initially plating a layer of metal upon the exposed surface of the polymer thick conductive films, and thereafter printing a defined pattern of dielectric upon the electroplated copper.

US Patent:

55028896, Apr 2, 1996

Filed:

Jan 8, 1993

Appl. No.:

8/001811

Inventors:

Keith L. Casson - Northfield MN
Carol Myers - Faribault MN
Kenneth B. Gilleo - W. Kingston RI
Deanna Suilmann - Bloomer WI
Edward Mahagnoul - Faribault MN
Marion Tibesar - Northfield MN

Assignee:

Sheldahl, Inc. - Northfield MN

International Classification:

H05K 336

US Classification:

29830

Abstract:

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

US Patent:

56885849, Nov 18, 1997

Filed:

Sep 27, 1995

Appl. No.:

8/534630

Inventors:

Keith L. Casson - Northfield MN
Carol Myers - Faribault MN
Kenneth B. Gilleo - W. Kingston RI
Deanna Suilmann - Bloomer WI
Edward Mahagnoul - Faribault MN
Marion Tibesar - Northfield MN

Assignee:

Sheldahl, Inc. - Northfield MN

International Classification:

B32B 900

US Classification:

428209

Abstract:

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.