Larry A Spiegel

US Patent:

7018268, Mar 28, 2006

Filed:

Apr 8, 2003

Appl. No.:

10/249433

Inventors:

Salman Moudrek Kassir - Paso Robles CA, US
Larry A. Spiegel - Pismo Beach CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 49/00

US Classification:

451 5, 451 41, 451289, 451388

Abstract:

The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the passage of a vacuum signal, a frame holding the protective material, a frame holder to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method provided by the invention can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.

US Patent:

7033252, Apr 25, 2006

Filed:

Feb 10, 2005

Appl. No.:

11/055550

Inventors:

John Fuhriman - San Luis Obispo CA, US
Carlton Wells - San Luis Obispo CA, US
Bill Kalenian - San Luis Obispo CA, US
Larry Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 1/00

US Classification:

451 41, 451288

Abstract:

A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface of the wafer carrier such that pressure in the bladder is independently regulated to control the downward force acting on the wafer during CMP. In addition, an edge control bladder may also be disposed within the carrier such that if the pressure in the bladder is also regulated, the amount of force on the edge of the wafer changes. By regulating retaining ring actuator pressure, inflatable membrane pressure, and edge control bladder pressure, non-uniformities in the wafer surface and edge effect may be addressed during CMP.

US Patent:

7063604, Jun 20, 2006

Filed:

Mar 4, 2005

Appl. No.:

11/072636

Inventors:

Larry A. Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 5/00

US Classification:

451285, 451398, 451402

Abstract:

A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is disposed within the carrier such that if the pressure in the bladder is regulated, the amount of force on the edge of the wafer changes. If a polishing process would cause material near the edge of the wafer to be removed at a higher rate than from the rest of the wafer, then the pressure is regulated within the bladder to reduce the force against the edge of the wafer. By reducing the force against the edge of the wafer, material is removed from the front side of the wafer at a uniform rate.

US Patent:

7063605, Jun 20, 2006

Filed:

Mar 18, 2005

Appl. No.:

11/084475

Inventors:

Larry A. Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 1/00

US Classification:

451286, 451398, 451297, 451287

Abstract:

A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and is pressed between the ridge and the mounting plate. Pressure in the bladder can be maintained or adjusted to deform the bladder and thereby force the retaining ring onto the polishing pad as the retaining ring is worn. Prior to adding pressure to the bladder, the ridge forces the bladder to very closely conform to the dimensions of the groove. Thus, during use, bladder deformation is not wasted on conforming the bladder to the groove shape, but instead can be used to force the retaining ring further in the direction of the pad. The ridge thereby increases the distance the retaining ring can move towards the pad.

US Patent:

7131892, Nov 7, 2006

Filed:

Apr 24, 2006

Appl. No.:

11/410440

Inventors:

John Fuhriman - San Luis Obispo CA, US
Carlton Wells - San Luis Obispo CA, US
Bill Kalenian - San Luis Obispo CA, US
Larry Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 1/00

US Classification:

451 41, 451288

Abstract:

A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface of the wafer carrier such that pressure in the bladder is independently regulated to control the downward force acting on the wafer during CMP. In addition, an edge control bladder may also be disposed within the carrier such that if the pressure in the bladder is also regulated, the amount of force on the edge of the wafer changes. By regulating retaining ring actuator pressure, inflatable membrane pressure, and edge control bladder pressure, non-uniformities in the wafer surface and edge effect may be addressed during CMP.

US Patent:

7238083, Jul 3, 2007

Filed:

Nov 7, 2006

Appl. No.:

11/594267

Inventors:

John Fuhriman - San Luis Obispo CA, US
Carlton Wells - San Luis Obispo CA, US
Bill Kalenian - San Luis Obispo CA, US
Larry Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 1/00

US Classification:

451 5, 451288, 451 41

Abstract:

A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface of the wafer carrier such that pressure in the bladder is independently regulated to control the downward force acting on the wafer during CMP. In addition, an edge control bladder may also be disposed within the carrier such that if the pressure in the bladder is also regulated, the amount of force on the edge of the wafer changes. By regulating retaining ring actuator pressure, inflatable membrane pressure, and edge control bladder pressure, non-uniformities in the wafer surface and edge effect may be addressed during CMP.

US Patent:

7959496, Jun 14, 2011

Filed:

Jan 3, 2008

Appl. No.:

11/969175

Inventors:

Larry A. Spiegel - San Luis Obispo CA, US

Assignee:

Strasbaugh - San Luis Obispo CA

International Classification:

B24B 1/00
B24B 5/02
B24B 5/35

US Classification:

451 59, 451 41, 451288, 451290, 451398, 451442

Abstract:

A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall.

US Patent:

20050075062, Apr 7, 2005

Filed:

Oct 7, 2003

Appl. No.:

10/680995

Inventors:

Larry Spiegel - San Luis Obispo CA, US

International Classification:

B24B001/00

US Classification:

451398000

Abstract:

A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and is pressed between the ridge and the mounting plate. Pressure in the bladder can be maintained or adjusted to deform the bladder and thereby force the retaining ring onto the polishing pad as the retaining ring is worn. Prior to adding pressure to the bladder, the ridge forces the bladder to very closely conform to the dimensions of the groove. Thus, during use, bladder deformation is not wasted on conforming the bladder to the groove shape, but instead can be used to force the retaining ring further in the direction of the pad. The ridge thereby increases the distance the retaining ring can move towards the pad.