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Kamyar Pashayi

age ~40

from Schenectady, NY

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Also known as:
  • Kamyar I
Phone and address:
1500 Huck Ct, Schenectady, NY 12303
Connected to:

Kamyar Pashayi Phones & Addresses

  • 1500 Huck Ct, Schenectady, NY 12303
  • Slingerlands, NY
  • Albany, NY
  • Cortlandt Manor, NY
  • Harrisburg, PA
  • Troy, NY
  • Philadelphia, PA
  • Pierrepont Manor, NY

Us Patents

  • High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-Polymer Composites

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  • US Patent:
    20120187332, Jul 26, 2012
  • Filed:
    Jan 24, 2012
  • Appl. No.:
    13/357190
  • Inventors:
    Sushumna Iruvanti - Wappingers Falls NY, US
    Theodorian Borca-Tasciuc - Troy NY, US
    Fengyuan Lai - Troy NY, US
    Kamyar Pashayi - Troy NY, US
    Joel Plawsky - Albany NY, US
  • Assignee:
    RENSSELAER POLYTECHNIC INSTITUTE - Troy NY
    INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
  • International Classification:
    C09K 5/06
    C09K 5/14
    B82Y 30/00
    B82Y 40/00
  • US Classification:
    252 73, 252 71, 977773, 977900
  • Abstract:
    A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

  • High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-Polymer Composites

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  • US Patent:
    20150247019, Sep 3, 2015
  • Filed:
    May 14, 2015
  • Appl. No.:
    14/712125
  • Inventors:
    - Armonk NY, US
    - Troy MI, US
    Fengyuan Lai - Troy NY, US
    Kamyar Pashayi - Troy NY, US
    Joel Plawsky - Albany NY, US
  • Assignee:
    Rensselaer Polytechnic Institute - Troy NY
  • International Classification:
    C08K 3/08
    C09D 139/06
    C08L 63/00
  • Abstract:
    A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.

Resumes

Kamyar Pashayi Photo 1

Kamyar Pashayi Harrisburg, PA

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Work:
Pennsylvania State University

Sep 2013 to 2000
Mechanical Engineering Faculty Hearth & Home Technologies
Halifax, PA
May 2013 to Aug 2013
Manufacturing Engineer Intern RPI Materials Research Center
Troy, NY
Jan 2013 to Apr 2013
Postdoctoral Research Associate Rensselaer Polytechnic Institute (RPI)
Troy, NY
Sep 2009 to Dec 2012
Research Assistant
Education:
Rensselaer Polytechnic Institute
Troy, NY
2009 to 2012
PhD in Mechanical Engineering University of Tehran
Tehrn
2006 to 2009
Masters of Science in Metallurgy Engineering Sharif University of Technology
Tehrn
2002 to 2006
Bachelors of Science in Material Science & Engineering
Skills:
Plasma and Wet Chemical Etch, Chemical/Physical Vapor Deposition (CVD & PVD), Photolithography, Defect Reduction, Thin Film Deposition, Wafer Bonding/Debonding, Mask Layout and Design, Sputtering, Diffusion, and Design of Experiments.
Kamyar Pashayi Photo 2

Kamyar Pashayi Philadelphia, PA

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Work:
Smart Materials Lab - Rensselaer Polytechnic Institute

2012 to 2000
Research Associate NanoTEC Lab - Rensselaer Polytechnic Institute
Troy, NY
Sep 2009 to Sep 2012
Research Assistant
Education:
Rensselaer Polytechnic Institute
Troy, NY
2009 to 2012
PhD in Mechanical Engineering University of Tehran
2006 to 2009
MS in Materials Science & Engineering Sharif University of Technology
2002 to 2006
BS in Materials Science & Engineering
Skills:
Laboratory: Materials characterization methods: SEM, TEM, RS, XRD, DSC, & TGA / Composites fabrication: Fabrication of Ceramic/Polymer-Metal Composites / Silicon & glass wafer processing: Photolithography, Etching, & PVD Metallization / Mechanical & thermal properties characterization: Fatigue, Fracture, Creep, & Thermal Conductivity / Software: Microsoft Office, ImageJ, MiniTab, LabVIEW, COMSOL

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Kamyar Pashayi Photo 3

Kamyar Pashayi

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