Joseph J Kreuzpaintner

US Patent:

20080223186, Sep 18, 2008

Filed:

Mar 14, 2007

Appl. No.:

11/685843

Inventors:

Amelia Leichliter - Palm Bay FL, US
JoAnn Marrell - West Melbourne FL, US
Joseph Kreuzpaintner - Orlando FL, US
Brynn Johnson - Melbourne FL, US

International Classification:

B26D 7/00

US Classification:

83 29

Abstract:

This invention is directed to a method for manufacturing MLI blankets, and MLI blankets which reduce PIM, which employs an existing cutting apparatus to perform a substantially automated cutting process with minimum hand operations resulting in increased productivity, improved uniformity of the blanket shapes and cut patterns, and, elimination of the use of templates.

US Patent:

20080223187, Sep 18, 2008

Filed:

Mar 14, 2007

Appl. No.:

11/685841

Inventors:

Amelia Leichliter - Palm Bay FL, US
JoAnn Marrell - West Melbourne FL, US
Joseph Kreuzpaintner - Orlando FL, US
Brynn Johnson - Melbourne FL, US

International Classification:

B26D 7/06

US Classification:

83100

Abstract:

This invention is directed to a punch tool having a vacuum collection device for punching openings in the layers of insulation material used in the formation of MLI blankets, and automatically removing debris produced in such punching operation.

US Patent:

20090097526, Apr 16, 2009

Filed:

Oct 11, 2007

Appl. No.:

11/870510

Inventors:

Joseph J. Kreuzpaintner - Orlando FL, US
Thomas Shenton - Indialantic FL, US
Steven E. Wilson - Malabar FL, US
Karen Wooldridge - Melbourne FL, US
Lee Burberry - West Melbourne FL, US
Hector Deju - Indialantic FL, US

Assignee:

HARRIS CORPORATION - Melbourne FL

International Classification:

G01N 25/00

US Classification:

374 57

Abstract:

The invention concerns a method and apparatus for performing an accelerated simulation of mechanical stresses and strains to evaluate the reliability of a sub-miniature interconnect. The method can begin by determining at least one characteristic of at least one thermal cycle to which a sub-miniature interconnect having a predetermined configuration will be exposed. The at least one characteristic can be selected to include a temperature change during the at least one thermal cycle. Thereafter, at least one value is calculated which represents a dimensional variation in a substrate () to which the sub-miniature interconnect is bonded. In particular, the dimensional variation is a calculated variation in the substrate dimension caused by the thermal cycle. The dimensional variation can include a longitudinal dimensional variation aligned with a length of the ribbon or the wire or a lateral dimensional variation aligned transverse to the ribbon or wire.

US Patent:

7479604, Jan 20, 2009

Filed:

Sep 27, 2007

Appl. No.:

11/862760

Inventors:

Brian Smith - Melbourne FL, US
Hector Deju - Indialantic FL, US
Scott Burri - Cocoa FL, US
Larry E. Crider - Melbourne FL, US
Joseph Kreuzpaintner - Orlando FL, US
Gregory M. Jandzio - Melbourne FL, US
Walter M. Whybrew - Grant FL, US

Assignee:

Harris Corporation - Melbourne FL

International Classification:

H05K 1/16

US Classification:

174260, 174262, 361761

Abstract:

At least one flexible appliance () and related method () for orthogonal, non-planar interconnections of at least a first electronic interface () disposed on a substrate () to an associated second electronic interface () positioned beneath the substrate (). The flexible appliance () is comprised of a planar body () having at least one electrical connector () extending from and orthogonally oriented relative to the planar body (). In one aspect of the invention, the electrical connector () is four electrical connectors (). There is at least one aperture () formed in the substrate () for allowing the first electronic interface () to be electrically interconnected to the associated second electronic interface (). The flexible appliance () is positioned on the substrate () by automated means. Contacts pads () on the resilient connector () are electrically connected to the second electronic interface () and the first electronic interface () by automated means such as soldering, thermo sonic bonding, or gap welding.