Youngwook Heo - Dallas TX, US John M. Beall - Richardson TX, US
Assignee:
TriQuint Semiconductor, Inc. - Hillsboro OR
International Classification:
H05K 7/10 H05K 7/00 H05K 7/12 H05K 1/11
US Classification:
361767, 361760, 361768, 361777, 361770, 361804
Abstract:
Embodiments include but are not limited to apparatuses and systems including a die package including a substrate, a die coupled with a top surface of the substrate, a package wall disposed on the top surface of the substrate and bounding the die, and a package lid coupled with the package wall, and including at least one protrusion facilitating a coupling of the package lid with the package wall. At least one edge of the top surface of the die pad may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. At least one edge of a top surface of at least one of the leads may include an etched portion such that a width of the top surface is narrower than a width of the bottom surface. Other embodiments may be described and claimed.
Lateral Varactor With Staggered Punch-Through And Method Of Fabrication
A lateral varactor is fabricated with a recess structure that provides staggered punch-through points, enabling the varactor to be tuned through punch-through without significant non-linearities in either capacitance or Q. The lateral varactor (30) includes a cathode (32) and an anode (40) disposed on the surface of an active layer (12). The anode (40) includes a surface section (45), and a recess section (46) disposed within a recess area (50). This recess structure results in a greater active layer depth under the anode surface section (45) than under the anode recess section (46). As a result, as reverse-bias voltage on the anode increases, the depletion region (60) reaches punch-through under the anode recess section (46) prior to reaching punch-through under the anode surface section (45). As a result, varactor capacitance depends upon the contributions associated with each anode section and sidewall capacitance, so that the abrupt impedance changes caused by tuning the varactor through a punch-through point is reduced, and varactor tuning is made more continuous.
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