Sterling Bruce Brown - Niskayuna NY Jennifer L. David - Clifton Park NY Robert Russell Gallucci - Mt. Vernon IN Yimin Jin - Glenmont NY Martin J. Lindway - Newburgh IN
A composition useful in the manufacturing of plastic cookware includes a polyetherimide resin and an acidic additive selected from the group consisting of aliphatic carboxylic acids having a vapor pressure less than one atmosphere at 300Â C. , aromatic carboxylic acids having a vapor pressure less than one atmosphere at 300Â C. , and combinations comprising at least one of the foregoing acidic additives. In one embodiment, the composition further comprises an additional resin, such as a polyester resin. The acidic additive is effective in improving the mold release and increasing the melt flow of the composition. Articles including the composition and a method for preparing the composition are also described.
Thin Bond-Line Silicone Adhesive Composition And Method For Preparing The Same
Sandeep Tonapi - Niskayuna NY, US Hong Zhong - Schenectady NY, US Florian Schattenmann - Ballston Lake NY, US Jennifer David - Clifton Park NY, US Kimberly Saville - Saratoga Springs NY, US Arun Gowda - Schenectady NY, US David Esler - Mayfield NY, US Ananth Prabhakumar - Schenectady NY, US
International Classification:
C08K003/00
US Classification:
524492000
Abstract:
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Hong Zhong - Niskayuna NY, US Jennifer David - Ballston Spa NY, US
International Classification:
C08L083/00
US Classification:
524588000
Abstract:
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Thin Bond-Line Silicone Adhesive Composition And Method For Preparing The Same
Sandeep Tonapi - Niskayuna NY, US Hong Zhong - Schenectady NY, US Florian Schattenmann - Ballston Lake NY, US Jennifer David - Clifton Park NY, US Kimberly Saville - Saratoga Springs NY, US Arun Gowda - Schenectady NY, US David Esler - Mayfield NY, US Ananth Prabhakumar - Schenectady NY, US
International Classification:
C08K003/34
US Classification:
524492000
Abstract:
Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polymer matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials and the corresponding mating surfaces.
Silicone Adhesive Composition And Method For Preparing The Same
A thermal interface material composition including a blend of a polymer matrix and a thermally conductive filler having particles having a maximum particle diameter no greater than about 25 microns, wherein the polymer matrix includes an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule and a hydrosilyation catalyst comprising a transition metal, wherein the transition metal is present in an amount of from about 10 to about 20 ppm by weight based on the weight of the non-filler components and the molar ratio of the silicon-bonded hydrogen atoms to the silicon-bonded alkenyl groups ranges from about 1 to about 2. A method is also provided.
Thermally Conductive Composition And Method For Preparing The Same
Hong Zhong - Niskayuna NY, US Sara Paisner - Albany NY, US Arun Gowda - Niskayuna NY, US David Esler - Mayfield NY, US Sandeep Tonapi - Niskayuna NY, US Jennifer David - Ballston Spa NY, US Paulo Meneghetti - Avon OH, US Laurence Maniccia - Lyndhurst OH, US Paul Hans - Medina OH, US Robert Fortuna - Parma OH, US Gregory Strosaker - Solon OH, US Gregory Shaffer - Strongsville OH, US Hollister Victor - Cleveland OH, US Ajit Sane - Medina OH, US
International Classification:
H01L 29/12
US Classification:
25206230T
Abstract:
Thermally conductive compositions containing spherical boron nitride filler particles having an average aspect ration of less than 2.0 in a polymer matrix.
Crack Resistant Coating Composition And Method Of Making Thereof
- Waterford NY, US Jennifer Lynn David - Ballston Spa NY, US Indumathi Ramakrishnan - Bangalore, IN Robert Hayes - Mechanicville NY, US Karthikeyan Murugesan - Bangalore, IN
Provided is a coating composition comprising (a) a component A of the formula (R)Si(OR), wherein Ris a C1-C3 monovalent hydrocarbon, Ris an Ror a hydrogen radical and d is 0, 1 or 2; (b) a component B selected from the group consisting of (R)Si(OR)(Formula 1) and/or (RO)(R)Si(R)(R)Si(R)Si(R)(OR)(Formula 2); (c) metal oxide particles; (d) UV absorber; (e) a catalyst; and (f) a solvent. The coating composition may provide a coating exhibiting good optical properties as well as durability, abrasion resistance, and/or crack resistance.
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