Seah Sun Too - San Jose CA, US Raj N. Master - San Jose CA, US Jacquana Diep - San Jose CA, US Mohammad Khan - Santa Clara CA, US
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L 21/44
US Classification:
438125, 257E23087, 257E2309, 257E23092, 257E25013
Abstract:
Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to a substrate, mixing an adhesive with a plurality of particles, and coupling a lid to the substrate with the adhesive. At least a portion of the plurality of particles in the adhesive oppose compressive force from the lid to restrict rotation of the lid relative to the substrate.
Integrated Circuit Package Lid With A Wetting Film
Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced.
Seah Sun Too - San Jose CA, US Raj N. Master - San Jose CA, US Jacquana Diep - San Jose CA, US Mohammad Khan - San Jose CA, US
Assignee:
GLOBALFOUNDRIES Inc. - Grand Cayman
International Classification:
H01R 12/00
US Classification:
439 70
Abstract:
Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate.
Filtration Membrane With Covalently Grafted Fouling-Resistant Polymer
Seah Sun Too - San Jose CA, US Mohammad Khan - San Jose CA, US James Hayward - Santa Clara CA, US Jacquana Diep - San Jose CA, US
International Classification:
H01R 13/46
US Classification:
174520
Abstract:
Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.
Thin Film Composite Membranes Embedded With Molecular Cage Compounds
A polymeric membrane on a support, wherein the polymeric membrane includes a crosslinked polymer covalently bound to a molecular cage compound. An interfacial polymerization method for making the polymeric membrane is also disclosed.
Composite Membrane With Multi-Layered Active Layer
Radwan A. Alrasheed - San Jose CA, US Blake W. Davis - Hollister CA, US Jacquana T. Diep - San Jose CA, US Geraud J. Dubois - Los Altos CA, US Young-Hye Na - San Jose CA, US Majed S. Nassar - San Jose CA, US Ankit Vora - San Jose CA, US
Assignee:
King Abdulaziz City for Science and Technology (KACST) - Riyadh International Business Machines Corporation - Armonk NY
International Classification:
B01D 71/56 B05D 1/36 B05D 3/02 B01D 61/02
US Classification:
210652, 21050038, 427402, 427384, 4274071
Abstract:
A thin film composite membrane includes an active layer on a support membrane, wherein the active layer includes at least two chemically distinct first and second crosslinked polyamide film sub-layers. The first film sub-layer includes a polyamide unit; and the second film sub-layer includes a copolyamide with two chemically distinct polyamide units. The first film sub-layer is closer to the support than is the second film sub-layer.
Composite Membrane With Multi-Layered Active Layer
- Armonk NY, US - Riyadh, SA Jacquana T. Diep - San Jose CA, US Geraud J. Dubois - Los Altos CA, US Young-Hye Na - San Jose CA, US Majed S. Nassar - San Jose CA, US Ankit Vora - San Jose CA, US
A thin film composite membrane includes an active layer on a support membrane, wherein the active layer includes at least two chemically distinct first and second crosslinked polyamide film sub-layers. The first film sub-layer includes a polyamide unit; and the second film sub-layer includes a copolyamide with two chemically distinct polyamide units. The first film sub-layer is closer to the support than is the second film sub-layer.