Hamid R Shokrgozar from 1465 Silverwood Dr, Phoenix, AZ 85048, age 63

Resumes

President And Chief Executive Officer

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Location:

Phoenix, AZ

Industry:

Semiconductors

Work:

White Electronic Designs
President and Chief Executive Officer

Education:

California State University, Fullerton 1978 - 1984

Advisory Board Member

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Location:

1713 north Glenview Ave, Anaheim, CA 92807

Industry:

Electrical/Electronic Manufacturing

Work:

Bwg Strategy Llc
Advisory Board Member
Sanmina
President - Viking Technology A Division of Sanmina
White Electronic Designs Oct 1998 - Aug 2008
President and Chief Executive Officer Chairman of the Board
White Microelectronics Jul 1993 - Oct 1998
President
White Technology Jul 1989 - Jul 1993
Vice President, Engineering

Education:

California State University, Fullerton 1978 - 1982
Bachelors, Bachelor of Science In Electrical Engineering, Bachelor of Science, Engineering, Electronics Engineering

Skills:

Manufacturing
Product Development
Semiconductors
Cross Functional Team Leadership
Strategy
Product Management
Business Development
Electronics
Strategic Planning
Engineering
Management
Leadership
Mergers and Acquisitions
Testing
Program Management
Product Marketing
Engineering Management
Process Engineering
Mergers
Start Ups
Team Building
Process Improvement
Six Sigma
Competitive Analysis
New Business Development
Lean Manufacturing
Business Strategy
Hardware
Operations Management
Embedded Systems
Sales
Finance
Forecasting
Aerospace
Executive Management
Project Planning
Strategic Partnerships
Supply Chain Management
Technical Engineering
Design of Experiments
Asic
Executive Operations Management
Medical Devices
Continuous Improvement
R

Interests:

Secondary Offerings
Investment Banking
Skiing
Investing
Ipo
Mergers and Acquisitions
High Technology Products

Languages:

English
Persian
French

President

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Location:

Anaheim, CA

Industry:

Semiconductors

Work:

Viking Technology
President

Us Patents

Stacked Silicon Die Carrier Assembly
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US Patent:

54347459, Jul 18, 1995
Filed:

Jul 26, 1994
Appl. No.:

8/280315
Inventors:

Hamid Shokrgozar - Phoenix AZ
Leonard Reeves - Phoenix AZ
Bjarne Heggli - Phoenix AZ
Assignee:

White Microelectronics Div. of Bowmar Instrument Corp. - Phoenix AZ
International Classification:

H05K 700
H01L 2118
US Classification:

361735
Abstract:

Disclosed is a stacked die carrier assembly and method for packaging and interconnecting silicon chips such as memory chips. The carrier is constructed from a metalized substrate onto which the chip is attached. The chip is wire bonded to the conductor pattern on the substrate. Each conductor then is routed to the edge of the substrate where it is connected to a half-circle of a metalized through hole. A frame is attached on top of this substrate. This frame has also a pattern of half-circle metalized through holes that aligns with the holes on the bottom substrate. The combination of the bottom substrate with the silicon die, and the frame on top, forms a basic stackable unit. Several such units can be stacked and attached on top of each other. The top unit can finally be covered with a ceramic lid that also has a matching half-circle metalized through hole pattern along its edge. To electrically interconnect the stacked assembly conductive epoxy can be applied in the grooves formed by the aligned half-circle plated through holes.