Gregory S Boettcher

US Patent:

6957622, Oct 25, 2005

Filed:

Feb 5, 2004

Appl. No.:

10/773605

Inventors:

Gregory S. Boettcher - Hopewell Junction NY, US
Steven B. Gold - Wappingers Falls NY, US
Robert P. Katz - Lagrangeville NY, US
Gabriel V. Moore - Wappingers Falls NY, US

Assignee:

International Business Machiens Corporation - Armonk NY

International Classification:

G01D011/00

US Classification:

116208, 116200

Abstract:

An in-situ wear indicator for detecting wear to at least one selected part in a semiconductor manufacturing environment. The indicator is manufactured in a selected material with a selected thickness so that the indicator degrades upon exposure to the semiconductor manufacturing process at a fixed rate relative to the wear of the selected part. The indicator displays a visual indication of wear which is discernible by an automated detection device.

US Patent:

7847683, Dec 7, 2010

Filed:

Sep 12, 2007

Appl. No.:

11/854035

Inventors:

Gregory S. Boettcher - Hopewell Junction NY, US
William R. Copeland - Poughkeepsie NY, US
Joseph P. DeGeorge - Wappingers Falls NY, US
Scott M. Hargash - Kingston NY, US
William T. Petry - Wappingers Falls NY, US
Robert R. Young - Poestenkill NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G08B 1/00
G08B 29/00
G08B 21/00
H01H 47/00
H05B 3/02

US Classification:

340532, 340635, 340506, 307125, 307139, 219507, 219509

Abstract:

An apparatus for implementing an emergency machine off circuit of a fabrication system, includes: at least one safety switch adapted for shunting an operation enable signal from a piece of equipment selected for removal from service, the switch also removing from service supplemental devices for the selected equipment. A semiconductor fabrication system and a method for removing equipment from service are provided.

US Patent:

57225796, Mar 3, 1998

Filed:

Apr 26, 1996

Appl. No.:

8/638415

Inventors:

Roy Yu - Wappingers Falls NY
James Patrick Wood - Beacon NY
Thomas Michael Biruk - Staatsburg NY
Gregory Scott Boettcher - Hopewell Junction NY
William Harrington Brearley - Poughkeepsie NY
Kimberley Ann Kelly - Poughkeepsie NY
Bouwe William Leenstra - Walden NY
Arthur Gilman Merryman - Hopewell Junction NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 1018
B23K 3102

US Classification:

228119

Abstract:

Multi-chip modules provided with a pin array may, under close scrutiny, display certain defects that may cause reliability problems. The presence of even one such defect necessitates the scrapping of the module. A method of salvaging the module is described, wherein the module is reworked by the method comprising the steps of applying a shearing force against the pins. During which the module is exposed to a temperature at or above that which is necessary for softening the braze material to remove the pins; polishing the surface of the module including the pads; evaporating the new pads; and attaching new pins to the pads.

US Patent:

61881244, Feb 13, 2001

Filed:

Jul 14, 1999

Appl. No.:

9/354374

Inventors:

Gregory S. Boettcher - Hopewell Junction NY
Robert P. Katz - Hopewell Junction NY
Ashwani K. Malhotra - Newburgh NY
James Wood - Beacon NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23544

US Classification:

257620

Abstract:

A semiconductor arrangement having a first active region and a dummy region on a surface of a substrate. The first active region and the dummy region are spaced from one another without any contact, and the dummy region is closer to an edge of the surface of the substrate in comparison to the first active region. Formed on the dummy region, first active region, and a portion of the substrate surface is a dielectric layer. The surface of the dielectric layer has an inactive portion and an active portion. A mask is disposed on the dielectric layer such that the mask contacts the inactive portion and does not contact the active portion.