10220 181St Ave SE, Issaquah, WA 98027 • 4253137664
27530 SE High Point Way, Issaquah, WA 98027
Mesa, AZ
Woodinville, WA
Seattle, WA
Sequim, WA
16715 171St Pl NE, Woodinville, WA 98072
Work
Company:
Siemens healthcare
Oct 2019
Position:
Principal engineer array architecture and processes, siemens medical solutions
Education
Degree:
Masters
School / High School:
University of Washington
1981 to 1984
Specialities:
Materials Science
Skills
R&D • Engineering Management • Manufacturing • Product Development • Medical Devices • Biomedical Engineering • Engineering • Design Control • Iso 13485 • Process Simulation • Management • Medical Imaging • Ultrasound • Materials • Design of Experiments • Research and Development • Cross Functional Team Leadership
Siemens Healthcare
Principal Engineer Array Architecture and Processes, Siemens Medical Solutions
Fujifilm Sonosite, Inc.
Director, Transducer Technology at Fujifilm Sonosite, Inc
Fujifilm Sonosite, Inc.
Transducer R and D Manager
Ge Healthcare Sep 1991 - Mar 1997
Senior Staff Engineer
Education:
University of Washington 1981 - 1984
Masters, Materials Science
Skills:
R&D Engineering Management Manufacturing Product Development Medical Devices Biomedical Engineering Engineering Design Control Iso 13485 Process Simulation Management Medical Imaging Ultrasound Materials Design of Experiments Research and Development Cross Functional Team Leadership
Us Patents
Multi-Dimensional Transducer Arrays And Method Of Manufacture
Grazyna Palczewska - Bellevue WA, US Stephen C. Englund - Bellevue WA, US Thomas G. Houck - Issaquah WA, US Gregg W. Frey - Woodinville WA, US Ron Ho - Mercer Island WA, US Xiaocong Guo - Woodinville WA, US
Assignee:
Siemens Medical Solutions USA, Inc. - Malvern PA
International Classification:
A61B 8/14
US Classification:
600459
Abstract:
A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.
Backing, Transducer Array And Method For Thermal Survival
Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
Electrically Conductive Matching Layers And Methods
Gregg W. Frey - Woodinville WA, US Walt T. Wilser - Cupertino CA, US Worth B. Walters - Cupertino CA, US Nelson H. Oliver - Sunnyvale CA, US
Assignee:
Siemens Medical Solutions USA, Inc. - Malvern PA
International Classification:
H01L 41/00 H04R 17/00
US Classification:
310322, 310334, 381354
Abstract:
Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
A multi-dimensional transducer array is provided. The multi-dimensional transducer array includes a plurality of elements. First and second kerfs acoustically separate the elements. A first width of the first kerf is larger than a second width of the second kerf.
Z-Axis Electrical Connection And Methods For Ultrasound Transducers
Stephen Englund - Bellevue WA, US Ellen Rowland - Bellevue WA, US Grazyna Palczewska - Bellevue WA, US Gregg Frey - Issaquah WA, US Lisa Fearn - Seattle WA, US Vaughn Marian - Saratoga CA, US Nelson Oliver - Sunnyvale CA, US Walter Wilser - Cupertino CA, US Worth Walters - Cupertino CA, US
International Classification:
H01L041/18
US Classification:
310334000
Abstract:
Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.
A matching layer is formed as a composite, such as a 2-2 or a 1-3 composite. The base material forms some portion, such as 5 or more percentage by volume, of the composite matching layer and volume. The in-fill, bonding or acoustically isolating material holds the sections of base material together and provides for control of the stiffness and cross coupling. By using an electrically conductive base material, electrical conductivity is provided from a top surface to a bottom surface. The composite is easily manufactured using dicing of a base material, filling of the kerfs and curing the filled kerfs.
Backing, Transducer Array And Method For Thermal Survival
Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.
Semiconductor Matching Layer In A Layered Ultrasound Transducer Array
Xuanming Lu - Issaquah WA, US Christopher M. Daft - Sunnyvale CA, US Gregg W. Frey - Issaquah WA, US
International Classification:
A61B 8/14
US Classification:
600459
Abstract:
A same transducer includes both piezoelectric and CMUT transducer layers. The semiconductor substrate used for the CMUT is also used as a matching layer. A portion of the semiconductor material is removed and the kerfs or voids are filled to provide the desired density, volume ratio, and/or acoustic impedance. This composite portion operates as a matching layer for the piezoelectric transducer layer.