Gregg Willi Frey

Address:

10220 181 Ave SE, Issaquah, WA 98027

Phone:

4253137664

VIN:

JN1AZ0CP2CT017360

Make:

NISSAN

Model:

LEAF

Year:

2012

US Patent:

6994674, Feb 7, 2006

Filed:

Jun 27, 2002

Appl. No.:

10/184785

Inventors:

Grazyna Palczewska - Bellevue WA, US
Stephen C. Englund - Bellevue WA, US
Thomas G. Houck - Issaquah WA, US
Gregg W. Frey - Woodinville WA, US
Ron Ho - Mercer Island WA, US
Xiaocong Guo - Woodinville WA, US

Assignee:

Siemens Medical Solutions USA, Inc. - Malvern PA

International Classification:

A61B 8/14

US Classification:

600459

Abstract:

A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

US Patent:

7358645, Apr 15, 2008

Filed:

Aug 19, 2004

Appl. No.:

10/921565

Inventors:

Gregg W. Frey - Issaquah WA, US

Assignee:

Siemens Medical Solutions USA, Inc. - Malvern PA

International Classification:

H01L 41/08

US Classification:

310327, 310322, 310326, 310334

Abstract:

Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.

US Patent:

7368852, May 6, 2008

Filed:

Aug 22, 2003

Appl. No.:

10/646130

Inventors:

Gregg W. Frey - Woodinville WA, US
Walt T. Wilser - Cupertino CA, US
Worth B. Walters - Cupertino CA, US
Nelson H. Oliver - Sunnyvale CA, US

Assignee:

Siemens Medical Solutions USA, Inc. - Malvern PA

International Classification:

H01L 41/00
H04R 17/00

US Classification:

310322, 310334, 381354

Abstract:

Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.

US Patent:

7518290, Apr 14, 2009

Filed:

Jun 19, 2007

Appl. No.:

11/820606

Inventors:

Gregg W. Frey - Issaquah WA, US

Assignee:

Siemens Medical Solutions USA, Inc. - Malvern PA

International Classification:

H01L 41/08

US Classification:

310334

Abstract:

A multi-dimensional transducer array is provided. The multi-dimensional transducer array includes a plurality of elements. First and second kerfs acoustically separate the elements. A first width of the first kerf is larger than a second width of the second kerf.

US Patent:

20050225210, Oct 13, 2005

Filed:

Apr 1, 2004

Appl. No.:

10/815307

Inventors:

Stephen Englund - Bellevue WA, US
Ellen Rowland - Bellevue WA, US
Grazyna Palczewska - Bellevue WA, US
Gregg Frey - Issaquah WA, US
Lisa Fearn - Seattle WA, US
Vaughn Marian - Saratoga CA, US
Nelson Oliver - Sunnyvale CA, US
Walter Wilser - Cupertino CA, US
Worth Walters - Cupertino CA, US

International Classification:

H01L041/18

US Classification:

310334000

Abstract:

Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.

US Patent:

20060028099, Feb 9, 2006

Filed:

Aug 5, 2004

Appl. No.:

10/912395

Inventors:

Gregg Frey - Issaquah WA, US

International Classification:

H01L 41/08

US Classification:

310334000

Abstract:

A matching layer is formed as a composite, such as a 2-2 or a 1-3 composite. The base material forms some portion, such as 5 or more percentage by volume, of the composite matching layer and volume. The in-fill, bonding or acoustically isolating material holds the sections of base material together and provides for control of the stiffness and cross coupling. By using an electrically conductive base material, electrical conductivity is provided from a top surface to a bottom surface. The composite is easily manufactured using dicing of a base material, filling of the kerfs and curing the filled kerfs.

US Patent:

20080163972, Jul 10, 2008

Filed:

Mar 20, 2008

Appl. No.:

12/052625

Inventors:

Gregg W. Frey - Issaquah WA, US

International Classification:

B29C 65/48

US Classification:

156 60

Abstract:

Backing blocks, transducer arrays and methods are provided for thermal cycle survivability. By decoupling a portion of the backing block from a case used to contain the transducer stack, the greater thermal expansion properties of most backing blocks may be minimized. For example, a rim is formed on the backing block material. The rim is bonded to the case structure while other portions of the backing block remain free of bonding to the case structure. During thermal cycling or other temperature changes, the backing block may be less likely to expand or bulge and crack, delaminate or damage transducer elements or other transducer materials.

US Patent:

20090082673, Mar 26, 2009

Filed:

Sep 26, 2007

Appl. No.:

11/904457

Inventors:

Xuanming Lu - Issaquah WA, US
Christopher M. Daft - Sunnyvale CA, US
Gregg W. Frey - Issaquah WA, US

International Classification:

A61B 8/14

US Classification:

600459

Abstract:

A same transducer includes both piezoelectric and CMUT transducer layers. The semiconductor substrate used for the CMUT is also used as a matching layer. A portion of the semiconductor material is removed and the kerfs or voids are filled to provide the desired density, volume ratio, and/or acoustic impedance. This composite portion operates as a matching layer for the piezoelectric transducer layer.