Hassan Hashemi - Laguna Niguel CA Shiaw Chang - Thousand Oaks CA Roger Forse - Santa Barbara CA Evan McCarthy - Costa Mesa CA Trang Trinh - Cypress CA Thuy Tran - El Monte CA
A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.
The invention provides techniques for compensating for current leakage from a loop filter during off times of a PLL between on times of the PLL, e. g. , when a cell phone is in paging mode. The leakage current is compensated by providing offsetting charge to ensure that the VCO tuning voltage when the PLL is turned from âoffâ to âonâ is at or near the VCO tuning voltage when the PLL is locked (the VCO-lock voltage). Several techniques can be used compensate for the leakage current and several techniques can be used to determine how accurately the leakage current is being compensated for, and what, if any, adjustments to make in the offsetting charge to adequately compensate for the leakage current.
Tunable Resonant Circuit And Voltage Controlled Oscillator Using Same
Evan S. McCarthy - Costa Mesa CA Jackie Cheng - Irvine CA
Assignee:
Skyworks Solutions, Inc. - Irvine CA
International Classification:
H03B 512
US Classification:
331117R, 331177 V
Abstract:
A programmable capacitive network for use in a tunable resonant circuit is set forth that may be used in a number of different applications, but is particularly useful in the tuning of a voltage controlled oscillator formed on a substrate, such as a semiconductor substrate or the like. The programmable capacitive network includes a plurality of capacitive elements. An interconnected network of voltage gate elements and fuse elements are interconnected with the capacitive elements to selectively connect one or more of the plurality of capacitive elements in the resonant circuit in response to at least one program control signal. In accordance with one embodiment, the voltage gate elements are diodes.
The invention provides techniques for compensating for current leakage from a loop filter during off times of a PLL between on times of the PLL, e. g. , when a cell phone is in paging mode. The leakage current is compensated by providing offsetting charge to ensure that the VCO tuning voltage when the PLL is turned from “off” to “on” is at or near the VCO tuning voltage when the PLL is locked (the VCO-lock voltage). Several techniques can be used compensate for the leakage current and several techniques can be used to determine how accurately the leakage current is being compensated for, and what, if any, adjustments to make in the offsetting charge to adequately compensate for the leakage current.
Multiple Chip Module With Integrated Rf Capabilities
Hassan Hashemi - Laguna Niguel CA, US Shiaw Chang - Thousand Oaks CA, US Roger Forse - Santa Barbara CA, US Evan McCarthy - Costa Mesa CA, US Trang Trinh - Cypress CA, US Thuy Tran - El Monte CA, US
A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.
Method And System For Signal Generation Via A Temperature Sensing Crystal Integrated Circuit
Evan McCarthy - Costa Mesa CA, US John Walley - Ladera Ranch CA, US Amir Ibrahim - Newport Beach CA, US Sunil Kanekal - San Jose CA, US Jared Welz - Seal Beach CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
G06F 19/00 H03C 1/62 G01K 1/00
US Classification:
702 99, 331158, 374117
Abstract:
Aspects of a method and system for signal generation via a temperature sensing crystal integrated circuit are provided. In this regard, a temperature sensing crystal integrated circuit (TSCIC) comprising a memory and a crystal or crystal oscillator may generate a signal indicative of a measured temperature. The generated signal and data stored in the memory may be utilized to configure one or more circuits communicatively coupled to the TSCIC. The data stored in the memory may characterize behavior of the TSCIC as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may indicate variations in frequency of the crystal or crystal oscillator as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may comprise one or both of a frequency value and a frequency correction value.
Method And System For An Energy Efficient Temperature Sensing Crystal Integrated Circuit
Evan McCarthy - Costa Mesa CA, US John Walley - Ladera Ranch CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
H03B 5/32
US Classification:
331 66, 331158, 331176
Abstract:
Aspects of a method and system for an energy efficient temperature sensing crystal integrated circuit (TSCIC) are provided. In this regard, one or more circuits in a temperature sensing crystal integrated circuit (TSCIC) may be configured to control power consumption of the TSCIC. The one or more circuits in the TSCIC may comprise a memory and a crystal. The one or more circuits in the TSCIC may be operable to generate an indication of temperature of the crystal. The one or more circuits in the TSCIC may be configured to control a current supplied to the crystal within the TSCIC, wherein the configuring is based on phase noise requirements of a signal generated by the crystal. Generation of the temperature indication may be enabled or disabled. The enabling or disabling may occur based on a rate of change of a temperature in the TSCIC.
Method And System For A Temperature Sensing Crystal Integrated Circuit With Digital Temperature Output
Evan McCarthy - Costa Mesa CA, US John Walley - Ladera Ranch CA, US Todd L Brooks - Laguna Beach CA, US Vinay Chandrasekhar - Irvine CA, US Josephus Van Engelen - Aliso Viejo CA, US Jared Welz - Seal Beach CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
H03L 1/00
US Classification:
374117, 374170, 331176
Abstract:
Aspects of a method and system for a temperature sensing crystal Integrated circuit with digital temperature output are provided. In this regard, an indication of temperature may be generated in an integrated circuit (IC) comprising a memory, a crystal or crystal oscillator, and at least a portion of an analog-to-digital converter. The temperature indication may be digitized via the analog-to-digital converter. Operation of one or more circuits may be controlled based on the digital temperature indication. The digital temperature indication may be communicated over a communication bus. An analog portion of the analog-to-digital converter may be integrated in the IC and may comprise, for example, a delta-sigma modulator. A digital portion of the analog-to-digital converter may be external to the IC and may comprise, for example, a digital filter.