Erica L Ouellette

US Patent:

20140051294, Feb 20, 2014

Filed:

Jan 16, 2013

Appl. No.:

13/743128

Inventors:

Chong Hun Yi - Mechanicsburg PA, US
Matthew Richard McAlonis - Elizabethtown PA, US
Kevin Thackston - York PA, US
Dustin Carson Belack - Hummelstown PA, US
Albert Tsang - Harrisburg PA, US
Nicholas Paul Ruffini - York PA, US
Darryl J. McKenney - Londonderry NH, US
Erica L. Ouellette - Dedham MA, US

Assignee:

MERCURY SYSTEMS, INC. - Chelmsford MA
TYCO ELECTRONICS CORPORATION - BERWYN PA

International Classification:

H01R 13/26

US Classification:

439625, 439884

Abstract:

An electrical contact is provided for mating with a mating contact. The electrical contact includes a base extending a length along a central longitudinal axis, and an arm extending a length outward from the base along the central longitudinal of the base. The arm includes a first mating bump and a second mating bump. The first and second mating bumps have respective first and second mating surfaces. The arm is configured to engage the mating contact at each of the first and second mating surfaces to establish an electrical connection with the mating contact. The first mating surface of the first mating bump is spaced apart along the length of the arm from the second mating surface of the second mating bump.

US Patent:

20170244184, Aug 24, 2017

Filed:

Feb 2, 2017

Appl. No.:

15/422978

Inventors:

- Andover MA, US
Absu METHRATTA - Waltham MA, US
Erica OUELLETTE - Boxboro MA, US

International Classification:

H01R 12/71
H05K 1/02
H05K 1/11
H01R 13/405
H01R 13/05

Abstract:

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

US Patent:

20170149154, May 25, 2017

Filed:

Feb 2, 2017

Appl. No.:

15/423269

Inventors:

- Chelmsford MA, US
Absu METHRATTA - Waltham MA, US
Erica OUELLETTE - Waltham MA, US

International Classification:

H01R 12/58
H05K 1/02
H01R 12/71

Abstract:

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

US Patent:

20170149155, May 25, 2017

Filed:

Nov 25, 2015

Appl. No.:

14/952242

Inventors:

- Chelmsford MA, US
Absu METHRATTA - Waltham MA, US
Erica OUELLETTE - Waltham MA, US

International Classification:

H01R 12/71
H05K 1/02
H01R 12/58

Abstract:

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.