David Scott Zuck

US Patent:

6926016, Aug 9, 2005

Filed:

Jul 18, 2003

Appl. No.:

10/622393

Inventors:

Dwight J. Zuck - Elk Grove CA, US
David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies, LLC - Dublin PA

International Classification:

B08B003/04

US Classification:

134 84, 134 89, 134902, 134135

Abstract:

Described are cleaning methods and apparatus that minimize the volume of hazardous materials used and created when cleaning components, and further to minimize the possibility of cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater-than the volume of liquid used to clean the component. One embodiment of the invention reduces the requisite volume of cleaning solution using a number of liquid-displacing elements (e. g. , balls) contained within a cleaning receptacle.

US Patent:

7073522, Jul 11, 2006

Filed:

Feb 9, 2005

Appl. No.:

11/055180

Inventors:

David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies, LLC - Dublin PA

International Classification:

B08B 9/00

US Classification:

134170, 134 941, 134201

Abstract:

Described are methods, systems, and chemistries for cleaning various components of semiconductor process equipment. A method in accordance with one embodiment cleans articles with differently contaminated interior and exterior surfaces by using those articles to separate a cleaning vessel into separate chambers, one chamber for the interior surface and one for the exterior surface. Different chemistries are then applied to the differently contaminated surfaces. This embodiment reduces the required volume of etchant, and consequently saves the cost, treatment, and disposal of toxic chemicals. One embodiment further reduces the requisite etchant volume using one or more volume-displacement elements that displace some of the etchant volume.

US Patent:

7328712, Feb 12, 2008

Filed:

May 12, 2005

Appl. No.:

11/128684

Inventors:

Dwight J. Zuck - Elk Grove CA, US
David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies - Dublin PA

International Classification:

B08B 3/04

US Classification:

134 84, 134 89, 134135, 134902

Abstract:

Described are cleaning benches and methods for removing contaminant layers from semiconductor process components using small volumes of hazardous liquids and minimizing cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. The cleaning bench can include different chemical baths for different components. Cassettes dedicated for use with particular components can be keyed to particular receptacles.

US Patent:

7427330, Sep 23, 2008

Filed:

Feb 12, 2008

Appl. No.:

12/069836

Inventors:

Dwight J. Zuck - Elk Grove CA, US
David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies, LLC - Dublin PA

International Classification:

B08B 3/04

US Classification:

134 26, 134 64 R, 134 76

Abstract:

Described are cleaning benches and methods for removing contaminant layers from semiconductor process components using small volumes of hazardous liquids and minimizing cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. The cleaning bench can include different chemical baths for different components. Cassettes dedicated for use with particular components can be keyed to particular receptacles.

US Patent:

7448397, Nov 11, 2008

Filed:

Jun 30, 2006

Appl. No.:

11/479883

Inventors:

David S. Zuck - Coppell TX, US

Assignee:

Rambus Inc. - Los Altos CA

International Classification:

C23G 1/02
B08B 3/00
B08B 3/04
B08B 9/00

US Classification:

134 221, 134 2, 134 3, 134 26, 134 28, 134 34, 134 36, 134 941, 134170, 118240

Abstract:

Described are methods, systems, and chemistries for cleaning various components of semiconductor process equipment. A method in accordance with one embodiment cleans articles with differently contaminated interior and exterior surfaces by using those articles to separate a cleaning vessel into separate chambers, one chamber for the interior surface and one for the exterior surface. Different chemistries are then applied to the differently contaminated surfaces. This embodiment reduces the required volume of etchant, and consequently saves the cost, treatment, and disposal of toxic chemicals. One embodiment further reduces the requisite etchant volume using one or more volume-displacement elements that displace some of the etchant volume.

US Patent:

7541094, Jun 2, 2009

Filed:

Feb 28, 2007

Appl. No.:

11/712802

Inventors:

David S. Zuck - Coppell TX, US
Gregory H. Leggett - Allen TX, US

Assignee:

Quantum Global Technologies, LLC - Dublin PA

International Classification:

B32B 9/04
B32B 13/04
C23G 1/02
C23F 1/00
H01L 21/306
B44C 1/22
C03C 15/00
C03C 25/68

US Classification:

428446, 134 3, 15634515, 15634512, 216 31, 216 52, 216 83, 216 88, 438905

Abstract:

Described are methods and chemistries for preparing firepolished quartz parts for use in semiconductor processing. The quartz parts in need of preparation include newly manufactured parts as well as parts requiring refurbishment after previous use in semiconductor processing. The embodiments described avoid methods and chemistries that may damage the surfaces of the quartz parts and render the parts unfit for use in semiconductor processing. A method in accordance with one embodiment minimizes damage by limiting exposure of the quartz parts to hydrofluoric acid. A quartz part for use in semiconductor processing comprises a surface including a surface portion having a surface portion area to expose to a gas, wherein at least 95 percent of the surface portion area is free of defects and wherein the surface portion has less than E12 atoms per centimeter squared of aluminum.

US Patent:

7624742, Dec 1, 2009

Filed:

Feb 22, 2006

Appl. No.:

11/360238

Inventors:

David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies, LLC. - Dublin PA

International Classification:

B08B 6/00
C25F 1/00
C25C 3/30
C25C 5/00

US Classification:

134 13, 438745, 438754

Abstract:

Described are methods of removing aluminum fluoride contaminants from aluminum, anodized aluminum, and sprayed ceramic surfaces. Hydrofluoric acid, long known to be effective at removing certain contaminants, has not been used to dissolve aluminum fluoride on aluminum-containing surfaces because the hydrofluoric acid strongly attacks such surfaces, and consequently damages sensitive components. Methods used in accordance with some embodiments remove aluminum fluoride using a mixture of hydrofluoric acid and one or more anhydrous acid. Suitable anhydrous acids include acetic acid.

US Patent:

7267132, Sep 11, 2007

Filed:

Feb 9, 2005

Appl. No.:

11/054794

Inventors:

David S. Zuck - Coppell TX, US

Assignee:

Quantum Global Technologies, LLC - Dublin PA

International Classification:

B08B 3/00

US Classification:

134149, 134137, 134152, 134157, 134166 R, 134170, 134201, 134902, 438905, 15634523

Abstract:

Described are methods, systems, and chemistries for removing layers of stubborn silicon and silicon-nitride contamination layers from the inside surfaces of such articles as deposition tubes. In such embodiments, a tube to be cleaned is gently rolled on it side while a portion the tube's interior surface is exposed to an etchant. The tube is only partially filled with etchant to reduce the requisite etchant volume, and the rolling motion evenly exposes the contaminated inner surface to the etchant.

Author:

David Zuck

ISBN #:

0272792926