Sarah E. Kim - Portland OR, US Bob Martell - Portland OR, US Dave Ayers - Fremont CA, US R. Scott List - Beaverton OR, US Peter Moon - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L029/40
US Classification:
257734, 257778, 257758
Abstract:
A process flow to make an interconnect structure with one or more thick metal layers under Controlled Collapse Chip Connection (C4) bumps at a die or wafer level. The interconnect structure may be used in a backend interconnect of a microprocessor. The one or more integrated thick metal layers may improve power delivery and reduce mechanical stress to a die at a die/package interface.
Dave Ayers of Big Deal Music added: Creatively, this is a special moment for a singular, massively important band. To have an opportunity to contribute to the efforts of everyone involved is a rare privilege. The record is a real watershed, and theres a whole new generation of fans about to be bor