Clark Douglas Fischbach

US Patent:

6351386, Feb 26, 2002

Filed:

Mar 13, 2001

Appl. No.:

09/805794

Inventors:

Clark Douglas Fischbach - West Dundee IL
Robert Alvin John Richter, Jr. - Lake in the Hills IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 770

US Classification:

361704, 361705, 361707, 361717, 361718, 361760, 361807, 361808, 257675, 257706, 257717

Abstract:

A component shim is used with printed circuit boards and heat spreaders , for example, where each of the printed circuit board and heat spreader has a surface that are in different spaced apart planes. A component has one lead attached to the surface of the printed circuit board. The component shim has a conductive section with an upper attachment layer and a lower attachment layer secured to opposed sides of the conductive section. The upper attachment layer is secured to a bottom of the component and the lower attachment layer is secured to a surface of the heat spreader. The total thickness of the conductive section and upper and lower attachment layers of the component shim is substantially equal to a distance from the bottom of the component to the surface of the heat spreader.

US Patent:

6449158, Sep 10, 2002

Filed:

Dec 20, 2001

Appl. No.:

10/027040

Inventors:

Ying Wang - Wheeling IL
Clark D. Fischbach - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361704, 361705, 361707, 361719, 361761, 257706, 257720, 2282622, 165 803, 165185

Abstract:

An electronic control module is provided wherein a power device is secured to a rigidizer, or heat spreader, such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface , preferably anodized aluminum, is disposed between device and rigidizer and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings are respectively applied to the surfaces and of the interface and surface of the rigidizer.

US Patent:

62665170, Jul 24, 2001

Filed:

Dec 30, 1999

Appl. No.:

9/475598

Inventors:

Douglas D. Fitzpatrick - Palatine IL
Clark D. Fischbach - West Dundee IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04B 104

US Classification:

455114

Abstract:

In a transmitter (200) that includes a radio frequency (RF) power amplifier (218), a predistortion signal loop (234, 240, 209, 208), and a feedforward correction loop (242, 246, 248, 250, 252, 258, 261, 262), a method and apparatus is provided for correcting distortion introduced into the transmitter by the RF power amplifier. The predistortion signal loop determines a RF power amplifier characterization function that characterizes a relationship between a signal input into the RF power amplifier and the resulting signal output by the RF power amplifier. The predistortion signal loop also determines a predistorted input signal that is based on an input signal received from an information source and on the RF power amplifier characterization function, which predistorted input signal is input into the RF power and includes input signal modifications that are meant to compensate for the distortion introduced introduced by the RF power amplifier. Any residual distortion that is introduced by the RF power and not canceled by the predistortion signal loop is then further reduced by the feedforward correction loop.

US Patent:

52968219, Mar 22, 1994

Filed:

May 3, 1993

Appl. No.:

8/055460

Inventors:

Michael W. Petersen - Elgin IL
Clark D. Fischbach - Hoffman Estates IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H03G 320

US Classification:

330141

Abstract:

Controlling transient responses in power amplifiers may be accomplished in the following manner. Upon detecting an output power adjustment request, a reference level is accessed from memory, wherein the reference level is based on a previous output condition that is substantially equal to the requested output condition. From the reference level, a first response time is calculated and supplied to a control circuit of the power amplifier such that the power amplifier operates at a first gain level. When the first response time elapses, the power amplifier operates at a second gain level, where the first gain level is greater than the second gain level.

US Patent:

50878930, Feb 11, 1992

Filed:

Dec 18, 1989

Appl. No.:

7/452172

Inventors:

Michael W. Petersen - Hoffman Estates IL
Clark D. Fischbach - Hoffman Estates IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H03G 330

US Classification:

330296

Abstract:

A circuit for providing DC bias voltage to an RF power amplifier transistor where the DC bias voltage is derived from the RF input signal.