Brian M Punsly

Author:

Brian Punsly

ISBN #:

3540414665

US Patent:

60808365, Jun 27, 2000

Filed:

Mar 20, 1997

Appl. No.:

8/822203

Inventors:

Brian M. Punsly - Torrance CA
Thomas G. Wong - Cypress CA

Assignee:

Hughes Electronics Corporation

International Classification:

B05D 300
C08J 700

US Classification:

528492

Abstract:

A method is provided for preparing the surface of a cyanate ester resin composite for metal plating. More particularly, a layer consisting essentially of cyanate ester resin is applied to the surface of the composite. Thereafter, the surface of the resin layer is etched, preferably by treatment with an etching solution containing either a quaternary ammonium hydroxide or a primary amine. Upon completion of the etching process, the cyanate ester resin layer may be successfully plated with metal. The method of the invention operates to improve adhesion between the cyanate ester resin composite and a subsequently-plated metal by providing the composite with a homogenous distribution of mechanical anchoring sites for a subsequently-plated metal, such that uniformity of adhesion is achieved. A cyanate ester resin composite prepared for plating in accordance with the invention may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.

US Patent:

58408290, Nov 24, 1998

Filed:

Nov 25, 1997

Appl. No.:

8/977031

Inventors:

Ralph D. Hermansen - Northridge CA
Brian M. Punsly - Torrance CA

Assignee:

Hughes Electronics Corporation - Los Angeles CA

International Classification:

C08G 6300
C08L 6700
B32B 3100
B31B 160

US Classification:

528363

Abstract:

An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.

US Patent:

57805814, Jul 14, 1998

Filed:

Oct 27, 1995

Appl. No.:

8/549139

Inventors:

Ralph D. Hermansen - Northridge CA
Brian M. Punsly - Torrance CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

C08G 5900
C08G 6300
C08L 6700
C08L 6300

US Classification:

528363

Abstract:

An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.

US Patent:

62706160, Aug 7, 2001

Filed:

Jul 1, 1998

Appl. No.:

9/109011

Inventors:

Brian M. Punsly - Torrance CA
Andre Wallace - Moreno Valley CA
William E. Elias - Manhattan Beach CA

Assignee:

Hughes Electronics Corporation - El Segundo CA

International Classification:

C09J 500
C09J 902
C08L 6302

US Classification:

156330

Abstract:

A family of adhesives is provided for bonding cyanate ester composite articles together which is also plateable with metal once chemically etched. The adhesives comprise a polymeric matrix and a filler of metal powder or metal flakes. The polymeric matrix comprises at least one polyepoxide resin and at least one curing agent. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure in air at a temperature less than 125. degree. C. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesives enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines. A cyanate ester resin structure assembled with the present adhesive composition may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive and comprehensive metallic coating.