Brian Samuel Beaman

US Patent:

6334247, Jan 1, 2002

Filed:

Jun 11, 1997

Appl. No.:

08/872519

Inventors:

Brian Samuel Beaman - Hyde Park NY
Keith Edward Fogel - Bardonia NY
Paul Alfred Lauro - Nanuet NY
Maurice Heathcote Norcott - Valley Cottage NY
Da-Yuan Shih - Poughkeepsie NY
George Frederick Walker - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 4300

US Classification:

29842, 29830, 29843, 174261, 361772

Abstract:

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

US Patent:

6380485, Apr 30, 2002

Filed:

Aug 8, 2000

Appl. No.:

09/634427

Inventors:

Brian Samuel Beaman - Apex NC
Joseph Curtis Diepenbrock - Raleigh NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 905

US Classification:

174 88R, 439497, 439579

Abstract:

A terminator assembly for a twinax wire. According to this embodiment, a PCB is provided which receives the twinax wire and provides a positive connection between a grounding bar of the PCB and the drain wide of the twinax pair. The drain wire is extended in an orthogonal direction to the twinax pair, and is engaged using an interference fit with the grounding bar. The grounding bar assembly also provides improved shielding for the twinax pair, where the integral shielding of the twinax wire has been removed to provide the connection. In an alternate embodiment, the terminating end of the twinax wire itself is encased in a termination clip. This clip provides shielding for the twinax pair, while electrically connecting with the twinax drain wire. The twinax wire, with the terminating clip, can then be easily attached to a connector PCB adapted to receive the terminator clip.

US Patent:

6452406, Sep 17, 2002

Filed:

Mar 11, 1999

Appl. No.:

09/254798

Inventors:

Brian Samuel Beaman - Apex NC
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Yun-Hsin Liao - Tempe AZ
Daniel Peter Morris - Purchase NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

US Patent:

6523255, Feb 25, 2003

Filed:

Jun 21, 2001

Appl. No.:

09/886960

Inventors:

Da-Yuan Shih - Poughkeepsie NY
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Brian Samuel Beaman - Apex NC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 300

US Classification:

29843, 29825, 29842, 228 45, 2281791

Abstract:

Method for repairing, reworking or replacing damaged probes that are formed using a flying lead wire bonding process used for testing integrated circuit devices and other electronic devices, with the same column and row spacing as the original probes and using the same height as the original probes.

US Patent:

6525551, Feb 25, 2003

Filed:

May 19, 1998

Appl. No.:

09/081342

Inventors:

Brian Samuel Beaman - Apex NC
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Eugene John OSullivan - Nyack NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324754, 324761

Abstract:

A probe structure for probing an electronic device. The probe has: a substrate having a substrate surface having a plurality of substrate electrical contact locations;a plurality of elongated electrical conductors having a first and second end; the first end of each of the plurality of elongated electrical conductors is electrically connected to one of the plurality of substrate electrical contact locations; a plate having a first and second side, and having a plurality of openings therein extending from the first side to the second side; the plate is disposed so that the first side thereof faces sad substrate; the second end of each of the plurality of elongated electrical conductors extends through one of the openings in the plate; a support for maintaining the plate at a distance from the substrate surface; the distance is selected so that the second ends project out from the second side of the plate a sufficient amount so that when the probe structure is pressed against a device under test the second ends of the elongated electrical conductors are maintained within a displacement from an original position by the opening so that the second ends of the elongated electrical conductors remain in contact with an electrical contact location on the device under test.

US Patent:

6526655, Mar 4, 2003

Filed:

May 31, 2001

Appl. No.:

09/871536

Inventors:

Brian Samuel Beaman - Apex NC
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 900

US Classification:

29843, 840868, 228188, 228199, 2281805

Abstract:

A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

US Patent:

6528984, Mar 4, 2003

Filed:

Mar 11, 1999

Appl. No.:

09/254768

Inventors:

Brian Samuel Beaman - Apex NC
Keith Edward Fogel - Mohegan Lake NY
Paul Alfred Lauro - Nanuet NY
Da-Yuan Shih - Poughkeepsie NY

Assignee:

IBM Corporation - Armonk NY

International Classification:

G01R 1073

US Classification:

3241581, 324754, 439 66, 439 91, 439 71

Abstract:

The present invention is directed to a structure comprising a substrate having a surface; a plurality of elongated electrical conductors extending away from the surface; each of said elongated electrical conductors having a first end affixed to the surface and a second end projecting away from the surface; there being a plurality of second ends; and a means for maintaining the plurality of the second ends in substantially fixed positions with respect to each other. The structure is useful as a probe for testing and burning in integrated circuit chips at the wafer level.

US Patent:

6618942, Sep 16, 2003

Filed:

Oct 4, 2001

Appl. No.:

09/970618

Inventors:

Brian S. Beaman - Apex NC
Scott J. Hadderman - Pleasant Valley NY
Richard D. Wheeler - Millerton NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 1300

US Classification:

29854, 439 59, 439 62, 439 67, 439260, 439267, 439329

Abstract:

A method for insertion of inserting printed circuit card into socket connectors which prevents sockets from getting contaminated or damaged during the insertion of a printed circuit card comprises the steps of: inserting a cam for moving a socket connectors contacts outwardly so that they will not make contact with a cards edge when it is inserted between the contacts of the sockets connector as it is inserted, and after the printed circuit card is inserted the printed circuit card moving the printed circuit card until it makes contact with a stop in the socket connector, and after the printed circuit card has contacted the stop in the socket connector, moving the cam to a closed position allowing the printed circuit card to be seated, and seating the printed circuit card by moving it to cause and allow for an amount of wipe to clean the connectors contacts without contaminating or damaging the socket connectors contacts during the insertion of said printed circuit card.