Alvin K Lau

US Patent:

6776848, Aug 17, 2004

Filed:

Jan 17, 2002

Appl. No.:

10/053296

Inventors:

Michael Rosenstein - Sunnyvale CA
Alex Shenderovich - San Francisco CA
Marc O. Schweitzer - San Jose CA
Ilya Lavitsky - San Francisco CA
Alvin Lau - San Francisco CA
Michael Feltsman - San Francisco CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 1600

US Classification:

118726, 118733, 118715, 20429812

Abstract:

A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.

US Patent:

7371285, May 13, 2008

Filed:

Mar 19, 2004

Appl. No.:

10/804300

Inventors:

Michael Rosenstein - Sunnyvale CA, US
Alex Shenderovich - San Francisco CA, US
Marc O. Schweitzer - San Jose CA, US
Ilya Lavitsky - San Francisco CA, US
Alvin Lau - San Francisco CA, US
Michael Feltsman - San Francisco CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 16/00
C23C 14/00
H01L 21/00
C25B 11/00

US Classification:

118715, 118726, 118733, 20429812

Abstract:

A semiconductor processing chamber having a motorized lid is provided. In one embodiment, the semiconductor processing chamber generally includes a chamber body having sidewalls and a bottom defining an interior volume. A lid assembly is coupled to the chamber body and is movable between a first position that encloses the interior volume and a second position. A hinge assembly thereto is coupled between the lid assembly and the chamber body. A motor is coupled to the hinge assembly to facilitate moving the lid assembly between the first position and the second position.

US Patent:

20130102283, Apr 25, 2013

Filed:

Nov 20, 2012

Appl. No.:

13/681588

Inventors:

Alvin Lau - Palo Alto CA, US
Sam Song Liang - Palo Alto CA, US
Jun Yang - Milpitas CA, US

International Classification:

H04W 12/06

US Classification:

455411

Abstract:

Methods, systems and apparatuses for authenticating a user of a mobile device are disclosed. One method includes tracking a plurality of locations of the mobile device, tracking motion behavior of the mobile device, and generating a user profile for the user over a period of time based on the tracked plurality of locations and the tracked motion behavior. A present user of the mobile device is authenticated based on a comparison of the user profile with a present user profile of the present user, wherein the present user profile comprises recent location information of the mobile device and recent motion behavior of the mobile device.

US Patent:

6736668, May 18, 2004

Filed:

Sep 15, 2000

Appl. No.:

09/663864

Inventors:

Arnold V. Kholodenko - San Francisco CA 94132
Senh Thach - Union City CA 94587
Wing L. Cheng - Sunnyvale CA 94087
Alvin Lau - San Francisco CA 94121
Dennis S. Grimard - Ann Arbor MI 48103

International Classification:

H01R 1300

US Classification:

439487, 439485

Abstract:

An electrical coupler comprises an inner connector having upper and lower ends, an insulative outer connector element circumscribing the inner connector, and a thermally conductive flange disposed over the upper end of the inner connector and the outer connector for conducting heat from the electrical conductor. The electrical conductor may be utilized in a substrate support for semiconductor wafer processing. The substrate support comprises a chuck body having an electrode embedded therein, and an upper male connector coupled to the electrode and protruding from said chuck body. A cooling plate having the electrical coupler is positioned proximate to the chuck body. The upper male connector is inserted in the electrical coupler, and a power source coupled to the lower portion of the electrical coupler chucks and biases a wafer to an upper surface of said chuck. The thermally conductive flange conducts and transfers heat generated from the upper male connector and electrical coupler to the cooling plate.