Continental
Senior Staff Electrical Engineer
Cooper Standard Sep 2010 - Mar 2012
Advanced Engineer
Fca Fiat Chrysler Automobiles Mar 2010 - Sep 2010
Systems Engineer
Visteon Corporation Jun 2000 - Sep 2009
Lead Pd Engineer
Ford Motor Company Sep 1986 - Jun 2000
Product Design Engineer
Education:
University of Michigan - Dearborn 1981 - 1983
Master of Science, Masters, Electrical Engineering
University of Michigan - Dearborn 1980 - 1981
Bachelors, Bachelor of Science, Electrical Engineering
University Politehnica of Bucharest 1976 - 1979
Adrian Gheorghiu (born 30 November 1981) is a Romanian professional footballer who currently plays for SC Vaslui. He is right footed and plays as a left winger, but
Us Patents
Method For Wave Soldering Of Surface Mounted Light Emitting Diodes
Christopher L. Rovik - Canton MI, US Wesley R. Corrion - Fenton MI, US Ricardo Hernandez - Canton MI, US Adrian G. Gheorghiu - Troy MI, US
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
G01D011/28
US Classification:
362 23, 362 26, 362800
Abstract:
An instrument cluster for communicating a vehicle's operating status to a vehicle occupant is disclosed. The instrument cluster includes a housing for supporting the instrument cluster. The housing is mountable to a vehicle instrument panel. A circuit board is secured to the housing. A motor having a motor shaft is rotatably coupled to the motor and the motor is secured to the circuit board. A gauge pointer is mounted on the motor shaft and rotatable therewith for indicating the vehicle's operating status. At least one diode is provided for illuminating the gauge pointer and at least one diode “footprint” is disposed on the circuit board proximate the motor shaft for electrically interconnecting the at least one diode to the circuit board. The at least one diode “footprint” has a cathode solder pad and an anode solder pad. The anode solder pad is substantially rectangular and the cathode solder pad is substantially L-shaped.
Adrian G. Gheorghiu - Ferndale MI Gregory B. Dahlin - Livonia MI Doo M. Yee - Westland MI Terrence D. Prestel - Livonia MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
H05K 100
US Classification:
174254
Abstract:
A circuit board includes conductive pads formed in a predetermined arrangement to permit a standardized component package to be properly placed in either of two electrical arrangements, such as an input or output buffer circuit, without separate mounting footprints for each type of electrical component, such as a transistor to be mounted on the footprint. A footprint comprising pads corresponding to the arrangement of terminals on a standardized package is provided with an extension including at least one pad so that a standardized package could be mounted in a rotated position. A circuit board arrangement incorporating the minimum footprint can also include adjacent pairs of pads to be located about the minimum footprint. The footprint and adjacent pairs of pads permits interchanging surface mount NPN and PNP transistors, and selection of the proper operating values for the surface mount resistors mounted on the pads, but does not affect the assembly of surface mount resistors or their location on the circuit board.